The effects of stabilizers on the bath stability of electroless Ni deposition and the deposit

Applied Surface Science

Volumn 229, Issue 1-4, 2004, Pages 282-300

  Cheong, W J ^a   Luan, Ben L ^a,b   Shoesmith, David W ^a  

^a UNIVERSITY OF WESTERN ONTARIO   (Canada)

^b NATIONAL RESEARCH COUNCIL CANADA   (Canada)

Author keywords

Characterization; Electroless nickel; Nano grains; Stabilizers

Indexed keywords

ADSORPTION; ASPECT RATIO; CHARACTERIZATION; FLUID DYNAMICS; MICROSTRUCTURE; MORPHOLOGY; NICKEL; OXIDATION; PH EFFECTS; PHASE COMPOSITION; STABILIZERS (AGENTS); TOPOLOGY;

ELECTROLESS NICKEL; MALEIC ACID; NANO-GRAINS; THIOUREA;

ELECTROLESS PLATING;

EID: 2342479856     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2004.02.003     Document Type: Article

References (35)

1. Shipley C.R. Jr. Plat. Surf. Finish. 71(6):1984;92-99.
2. G.O. Mallory, J.B. Hajdu, Electroless Plating, American Electroplaters & Surface Finishing Society, Norwich, New York, United States, 1996.
3. W. Riedel, Electroless Nickel Plating, Finishing Publications Ltd./ASM International, Stevengae, Hertfordshire, England/Metals Park, OH, USA, 1991, pg. 17, 50, 68.
4. Touhami M.E., Chassaing E., Cherkaoui M. Electrochim. Acta. 48:2003;3651-3658.
5. Gutzeit G. Plating. 46:1959;1158-1164.
6. De Minjer C.H., Brenner A. Plating. 12:1957;1297-1305.
7. Rozenblyum R.G., Burakov M.B., D'yakov A.A. Prot. Met. (Russia). 7(3):1971;307-309.
8. M. Schlesinger, Electroless deposition of nickel, John Wiley & Sons, Inc., Canada, 2000, p. 667.
9. N. Feldstein, D.J. Lindsay, US Patent 5 863 616.
10. Namboodiri P.N.N., Prasad K.V., Mathur P.B. Trans. SAEST. 7:1972;122-126.
11. Gabrielly G., Raulin F. J. Appl. Electrochem. 1:1971;167.
12. E. Lanzoni, C. Martini, R. Ruggeri, R. Bertoncello, A. Glisenti European federation of corrosion publications (1997) 232-243.
13. Sallo J.K., Sallo J.S. J. Electrochem. Soc. 112(12):1965;1201-1203.
14. A. Egli, J. Heber, Patent EP1306465A2.
15. Das L., Chin D.T. Plat. Surf. Finish. 83(8):1996;55-61.
16. F.A. Roux, France Patent 1 207 218.
17. Huh J., Lee J.-H. Surf. Eng. Mater. Sci. 1:2000;37-45.
18. A. Brenner, G.E. Riddell, J. Res. Natl. Bureau Standards 37 (46) 1946, pg. 31-34.
19. Huh J., Lee J.-H. J. Corros. Sci. Soc. Korea. 29(1):2000;46-53.
20. Petukhov I.V., Shcherban M.G. Prot. Met. 35(6):1999;566-570.
21. Salvago G., Fumagalli G. Met. Finish. 85(3):1987;31-35.
22. G. Salvago, D. Sinigaglia, G. Fumagalli, D. Continenza, G. Taccani, in: Proceedings of the INTERFINISH 80, 1980.
23. E.R. Ramirez, US Patent 2 884 344.
24. El-Mallah A.T., Abbas M.H., Morsy M.S., Abdel-Meguid E.M. Met. Finish. 89(7):1991;7-10.
25. El-Rehim S.S.A. Met. Finish. 94:1996;29-33.
26. Gad M.R., El-Magd A. Met. Finish. 99(2):2001;77-83.
27. Sallo J.S., Kivel J., Albers F.C. J. Electrochem. Soc. 110(8):1963;890-894.
28. K.-P. Han, J.-L. Fang, Int. J. Chem. Kin. 28 (4) (1995) 259-264.
29. Chen B.H., Hong L., Ma Y., Ko T.M. Ind. Eng. Chem. Res. 41(11):2002;2668-2678.
30. Salvago G., Cavallotti P. Plating. 59(7):1972;665.
31. Petukhov I.V., Shcherban M.G., Skryabina N.E., Malinina L.N. Prot. Met. 38(4):2002;370-376.
32. Rantell A. Trans. Inst. Met. Finish. 48(5):1970;191-198.
33. M. Tian, J. Wang, J. Kurtz, T.E. Mallouk, M.H.W. Chan, Nano Lett. 3 (7) (2003) 919-923.
34. Macheras J., Vouros D., Kollia C., Spyrellis N. Trans. Inst. Met. Finish. 74(2):1996;55-58.
35. K. Azumi, T. Yugiri, T. Kurihara, M. Seo, H. Habazaki, S. Fujimoto, J. Electrochem. Soc. 150 (7) (2003) C461-C464.