Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm

Mechanics of Materials

Volumn 38, Issue 7, 2006, Pages 585-598

  Gomez, Juan ^a   Basaran, Cemal ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Constitutive modeling; Damage mechanics; Integration scheme; Microelectronics packaging; Rate dependence; Solder joints

Indexed keywords

ALGORITHMS; COMPUTATIONAL COMPLEXITY; COMPUTER SIMULATION; INTEGRATION; KINEMATICS; MATHEMATICAL MODELS;

CONSTITUTIVE MODELING; DAMAGE MECHANICS; INTEGRATION SCHEME; MICROELECTRONICS PACKAGING; RATE DEPENDENCE;

SOLDERED JOINTS;

EID: 33645049059     PISSN: 01676636     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mechmat.2005.11.008     Document Type: Article

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