In-situ SEM observation on fracture behaviors of Sn-based solder alloys

Journal of Materials Science

Volumn 40, Issue 8, 2005, Pages 1993-2001

  Ding, Ying ^a   Wang, Chunqing ^a   Li, Mingyu ^b   Bang, Han Sur ^a,c  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b SHENZHEN UNIVERSITY   (China)

^c Chosun University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; FRACTURE; FREQUENCIES; GRAIN SIZE AND SHAPE; LEAD; SCANNING ELECTRON MICROSCOPY; TENSILE PROPERTIES; TIN;

CRACK TIPS; DISPLACEMENT RATE; FRACTURE BEHAVIOR; GRAIN BOUNDARY SLIDING;

SOLDERED JOINTS;

EID: 17444417772     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10853-005-1222-6     Document Type: Article

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