Multi-scale analysis of polysilicon MEMS sensors subject to accidental drops: Effect of packaging

Microelectronics Reliability

Volumn 49, Issue 3, 2009, Pages 340-349

  Ghisi, Aldo ^a   Fachin, Fabio ^b   Mariani, Stefano ^a   Zerbini, Sarah ^c  

^a POLITECNICO DI MILANO   (Italy)

^b Massachusetts Institute of Technology   (United States)

^c STMICROELECTRONICS   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

DROPS; IMPACT STRENGTH; JOINTS (STRUCTURAL COMPONENTS); MEMS; POLYSILICON; SENSORS; TARGETS;

ACCIDENTAL DROPS; BOTTOM SURFACES; CARRYING CAPACITIES; DROP CONFIGURATIONS; FINITE-ELEMENT APPROACHES; LENGTH-SCALE; MEMS SENSORS; MICRO-ELECTRO- MECHANICAL SYSTEMS; MULTI-SCALE ANALYSIS; STRESS STATE; TARGET SURFACES; TOP SURFACES;

MICROELECTROMECHANICAL DEVICES;

EID: 59249107443     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.12.010     Document Type: Article

References (21)

1. Varghese J., and Dasgupta A. Test methodology for durability estimation of surface mount interconnects under drop testing conditions. Microelectron Reliab 47 (2007) 93-103
2. Luan J., Tee T.Y., Peck E., Lim C.T., and Zhong Z. Dynamic responses and solder joint reliability under board level drop test. Microelectron Reliab 47 (2007) 450-460
3. Ghaffarian R. CCGA packages for space applications. Microelectron Reliab 46 (2006) 2006-2024
4. Srikar V.T., and Senturia S.D. The reliability of microelectromechanical systems (MEMS) in shock environments. J Microelectromech Sys 11 (2002) 206-214
5. Cheng Z, Huang W, Cai X, Xu B, Luo L, Li X. Packaging effects on the performances of MEMS for high-g accelerometer: frequency domain and time-domain analyses. In: Proceedings of HDP'04, 2004. p. 282-289.
6. Wagner U., Franz J., Schweiker M., Bernhard W., Müller-Friedler R., Michel B., et al. Mechanical reliability of MEMS-structures under shock load. Microelectron Reliab 41 (2001) 1657-1662
7. Li G.X., and Shemansky F.A. Drop test and analysis on micro machined structures. Sensors Actuat A 85 (2000) 280-286
8. Mariani S., Ghisi A., Corigliano A., and Zerbini S. Multi-scale analysis of MEMS sensors subject to drop impacts. Sensors 7 (2007) 1817-1833
9. Mariani S., Ghisi A., Fachin F., Cacchione F., Corigliano A., and Zerbini S. A three-scale FE approach to reliability analysis of MEMS sensors subject to drop impacts. Meccanica 43 (2008) 469-483
10. Choa S.H. Reliability of vacuum packaged MEMS gyroscopes. Microelectron Reliab 45 (2005) 361-369
11. Tanner DM, Walraven A, Hegelsen K, Irwin LW, Brown F, Smith NF, et al. MEMS reliability in shock environments. In: 38th Annual international reliability physics symposium, San Jose, California, 2000. p. 129-138.
12. Shi B.J., Shu D.W., Wang S., Luo J., Ng Q., Lau J.H.T., et al. Shock response and power spectrum analysis of a head actuator assembly. Impact loading of lightweight structures. WIT Transactions on Engineering Sciences vol. 49 (2005), WIT Press
13. Jiang D., and Shu D. Predication of peak acceleration of one degree of freedom structures by scaling law. ASCE J Struct Eng 131 (2005) 582-588
14. Suhir E. Is the maximum acceleration an adequate criterion of the dynamic strength of a structural element in an electronic product?. IEEE Trans Compon, Packag Manifact Technol 20 (1997) 513-517
15. Mullen R.L., Ballarini R., Yin Y., and Heuer H. Monte Carlo simulation of effective elastic constants of polycristalline thin films. Acta Mater 45 (1997) 2247-2255
16. Cho S.W., and Chasiotis I. Elastic properties and representative volume element of polycrystalline silicon for MEMS. Exp Mech 47 (2007) 37-49
17. Chasiotis I., and Knauss W.G. The mechanical strength of polysilicon films. Part 2: size effect associated with elliptical and circular perforations. J Mech Phys Solids 51 (2003) 1551-1572
18. Boroch R., Wiaranowski J., Müeller-Fiedler R., Ebert M., and Bagdahn J. Characterization of strength properties of thin polycrystalline silicon films for MEMS applications. Fatigue Fract Eng Mater Struct 30 (2007) 2-12
19. Falcon E., Laroche C., Fauve S., and Coste C. Collision of a 1-D column of beads with a wall. Euro Phys J B 5 (1998) 111-131
20. Ponte Castaneda P., and Suquet P. Nonlinear composites. Adv Appl Mech 34 (1998) 171-302
21. Clancy L.J. Aerodynamics (1998), Pearson Higher Eduction