Packaging effects on the performances of MEMS for high-G accelerometer: Frequency-domain and time-domain analyses

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Volumn , Issue , 2004, Pages 282-289

  Cheng, Zhaonian ^a,b   Huang, Weidong ^b   Cai, Xia ^b   Xu, Bulu ^b   Luo, Le ^b   Li, Xinxin ^b  

^a SHANGHAI UNIVERSITY   (China)

^b INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

Author keywords

Frequency domain analysis; High G accelerometer; Sensor packaging; Time domain analysis

Indexed keywords

ACCELEROMETERS; COMPUTER SIMULATION; CONDUCTIVE MATERIALS; DIGITAL FILTERS; ELASTIC MODULI; FINITE ELEMENT METHOD; FREQUENCY DOMAIN ANALYSIS; MICROELECTROMECHANICAL DEVICES; TIME DOMAIN ANALYSIS;

ACCELEROMETER CHIPS; HIGH-G ACCELEROMETERS; PACKAGING STRESS; SENSOR PACKAGING;

ELECTRONICS PACKAGING;

EID: 14844309682     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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