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Volumn 43, Issue 5, 2008, Pages 469-483

A three-scale FE approach to reliability analysis of MEMS sensors subject to impacts

Author keywords

Drop impacts; Micro mechanics; Multi scale FE analysis; Polysilicon MEMS sensors; Shocks

Indexed keywords

COMPOSITE MICROMECHANICS; FINITE ELEMENT METHOD; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSENSORS; POLYSILICON; RELIABILITY ANALYSIS; SENSOR NETWORKS; SENSORS;

EID: 53549100494     PISSN: 00256455     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11012-008-9111-0     Document Type: Article
Times cited : (41)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.