SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 2, 2009, Pages 345-350

Effects of thermal aging on microstructure and microhardness of Sn-3.7Ag-0.9Zn-1In solder

(5) Wei, Chen a Liu, Yongchang a Gao, Zhiming a Wan, Jingbo a Ma, Changsheng a

a TIANJIN UNIVERSITY (China)

Author keywords

Intermetallics; Lead free solder; Microhardness; Microstructure; Thermal aging

Indexed keywords

COOLING RATES; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER; MICROSTRUCTURAL OBSERVATIONS; SLOWLY COOLED; SN DENDRITES; STRUCTURAL STABILITIES; SYSTEM ENERGIES;

BRAZING; CERIUM ALLOYS; COARSENING; COOLING; COOLING WATER; CRYSTAL GROWTH; DENDRITES (METALLOGRAPHY); GRAIN BOUNDARIES; INTERMETALLICS; LEAD; METALLIC COMPOUNDS; MICROHARDNESS; MICROSTRUCTURE; NEURONS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; STABILITY; THERMAL AGING; WATER COOLED REACTORS; WATER COOLING SYSTEMS; WELDING; ZINC;

TIN;

EID: 58349083454 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0586-1 Document Type: Article

Times cited : (9)

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