Effects of boundary conditions and source dimensions on the effective thermal conductivity of a printed circuit board

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 423-428

  Shabany, Younes ^a  

^a Applied Thermal Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTATIONAL FLUID DYNAMICS; HEAT CONDUCTION; HEAT FLUX; HEAT TRANSFER; MATHEMATICAL MODELS; THERMAL CONDUCTIVITY OF SOLIDS; CARBON FIBER REINFORCED PLASTICS; ELECTRONICS PACKAGING; HEAT CONVECTION; PRINTED CIRCUIT MANUFACTURE; THERMAL CONDUCTIVITY; THERMOANALYSIS;

BIOT NUMBER; HEAT CONDUCTION EQUATIONS; BOARD SIZE; BOTTOM BOUNDARY CONDITIONS; CONVECTION HEAT TRANSFER; COPPER LAYER; EFFECTIVE THERMAL CONDUCTIVITY; NUMERICAL SOLUTION; SOURCE DIMENSIONS;

PRINTED CIRCUIT BOARDS;

EID: 1242287035     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35201     Document Type: Conference Paper

References (8)

1. V. P. Manno, N. R. Kurita and K. Azar. Experimental characterization of board conduction effetcs. Proceedings of the Ninth IEEE SEMI-THERM Symposium, pages 127-135, February 1993.
2. H. Shaukatullah and M. Gaynes. Experimental determination of the effect of printed circuit card conductivity on the thermal performance of surface mount electronic packages. Proceedings of the Tenth IEEE SEMI-THERM Symposium, pages 44-52, February 1994.
3. Yunus A. Cengel. Heat Transfer, A Practical Approach. McGraw-Hill, 1998.
4. T. F. Lemczyk, B. Mack, J. R. Culham and M. M. Yovanovich. PCB trace thermal analysis and effective conductivity. Proceedings of the Seventh IEEE SEMI-THERM Symposium, pages 15-22, February 1991.
5. J. Lohan, P. Tiilikka, P. Rodgers, C-M. Fager and J. Rantala. Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection. Proceedings of the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2000), Vol. 2, pages 213-225, May 2000.
6. J. R. Culham and M. M. Yovanovich. Factors affecting the calculation of effective conductivity in printed circuit boards. Proceedings of the Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm'98), pages 460-467, May 1998.
7. Y. Shabany. Component size and effective thermal conductivity of printed circuit boards. Proceedings of the Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2002), pages 489-494, May 2002.
8. Icepak Version 3 User's Guide. Fluent Inc., Lebanon, NH, 1999.