Optimization of thermal via design parameters based on an analytical thermal resistance model

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 475-480

  Li, R S ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HEAT CONDUCTION; HEAT RESISTANCE; MATHEMATICAL MODELS; OPTIMIZATION; PLATING; SUBSTRATES;

HEAT SPREADING EFFECTS; THERMAL VIA PAD;

PRINTED CIRCUIT DESIGN;

EID: 0031628846     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)