PCB thermal via optimization using design of experiments

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 224-228

  Asghari, Tony A ^a  

^a MOTOROLA INC   (United States)

Author keywords

Design of experiments; Factorial design; Icepak CFD; MINITAB ; Optimization; PCB; Thermal resistance; Thermal via

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SOFTWARE; HEAT RESISTANCE; OPTIMIZATION; STATISTICAL METHODS;

DESIGN OF EXPERIMENTS (DOE); FACTORIAL DESIGN; THERMAL VIA OPTIMIZATION;

PRINTED CIRCUIT BOARDS;

EID: 33845569750     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645346     Document Type: Conference Paper

References (7)

1. th IEEE SEMI-THERM Symposium, 2004.
2. A. Zargari and W. R. Grise, "A Comparison of Traditional Methods of Setting-Up the Experiments with the Utilization of Computer-Based DOE Software: Validation of a Scientific Experiment", Electrical Insulation Conference & Electrical Manufacturing & Coil Winding Conference, 1999.
3. B. A. Zahn, "Steady State Thermal Characterization and Junction Temperature Estimation of Multi-Chip Module Packages Using the Response Surface Method", IEEE Transactions on Components & Packaging Technologies, Vol. 23, No. 1, March 2000.
4. D. C. Montgomery, Design & Analysis of Experiments. New York: John Wiley & Sons, Inc., 2001.
5. F. P. Incropera and D. P. DeWitt, Fundamentals of Heat and Mass Transfer. New York: John Wiley & Sons, Inc., 1996.
6. th Edition. Pacific Grove, CA: Duxbury, Thomson Learning, 2001.
7. Icepak® 4.1 Users Guide. Fluent© Inc, 2005.