Selection of appropriate thermal model for printed circuit boards in CFD analysis

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 234-242

  Shankaran, Gokul V ^a   Singh, Rahul K ^a  

^a Fluent India Private Limited   (India)

Author keywords

CFD; Compact PCB model; Heat spreading; Layer wise lumped PCB model; Numerical analysis; Orthotropic conductivity; Printed circuit board; Trace coverage

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; ERROR ANALYSIS; MATHEMATICAL MODELS; THERMAL EFFECTS;

COMPACT PCB MODELS; HEAT SPREADING; LAYER-WISE LUMPED PCB MODELS; ORTHOTROPIC CONDUCTIVITY; TRACE COVERAGE;

PRINTED CIRCUIT BOARDS;

EID: 33845564108     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645348     Document Type: Conference Paper

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