Wiring statistics and printed wiring board thermal conductivity

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2001, Pages 252-260

  Nelson, R D ^a  

^a TeraVicta Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; FINITE ELEMENT METHOD; PROBABILITY DISTRIBUTIONS; STATISTICAL METHODS; THERMAL CONDUCTIVITY;

POWER LAW APPROXIMATION; WIRING STATISTICS;

PRINTED CIRCUIT BOARDS;

EID: 0035023778     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)