Printed circuit board thermal modeling without the use of an effective thermal conductivity

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART A, Issue , 2005, Pages 19-26

  Sampson, Richard L ^a  

^a NONE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL COMPLEXITY; NETWORKS (CIRCUITS); PROBLEM SOLVING; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

COMPUTATION OF SYSTEM TEMPERATURES; INTERNODAL CONDUCTANCES;

PRINTED CIRCUIT BOARDS;

EID: 32844457169     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73013     Document Type: Conference Paper

References (4)

1. Baum, J.R., Dickerson, P., Duffy, V., Jimenez, R., Welling, J., "Thermal Design Considerations for Packaging Electronic Equipment", in "Handbook of Electronic Packaging", Harper, C., A. (editor), Mc-Graw Hill, 1969
2. Lemczyk, T.F., Mack, B.L., Culham, J.R., Yovanovich, M.M., "PCB Trace Thermal Analysis and Effective Conductivity", ASME Journal of Electronic Packaging, vol. 114, December 1992
3. Culham, J.R., Yovanovich, M.M., "Factors Affecting the Calculation of Effective Conductivity in Printed Circuit Boards", ITHERM '98, Sixth Intersociety Conference on Thermal and Mechanical Phenomena in Electronic Systems, 1998
4. Shabany, Y., "Component Size and Effective Thermal Conductivity", ITHERM '98, Eighth Intersociety Conference on Thermal and Mechanical Phenomena in Electronic Systems, 2002