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Volumn , Issue , 1996, Pages 191-200
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Use of a 1-dimensional heat flow model to calculate circuit board thermal resistance for use in the MQUAD package thermal model
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CALCULATIONS;
FINITE ELEMENT METHOD;
MATHEMATICAL MODELS;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT TESTING;
THERMAL CONDUCTIVITY;
THERMODYNAMIC PROPERTIES;
HEAT FLOW MODEL;
LUMPED PARAMETER THERMAL MODEL;
MQUAD PACKAGE;
PACKAGE FOOTPRINT;
THERMAL PROFILES;
THERMAL RESISTANCE;
ELECTRONICS PACKAGING;
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EID: 0029721729
PISSN: 10652221
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (3)
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References (5)
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