Effects of plasmas on porous low dielectric constant CVD SiOCH films

Microelectronic Engineering

Volumn 86, Issue 2, 2009, Pages 176-180

  Vinogradova, E ^a   Osei Yiadom, E ^a   Smith, C E ^a,b   Mueller, D W ^a   Reidy, R F ^a  

^a UNIVERSITY OF NORTH TEXAS   (United States)

^b SEMATECH   (United States)

Author keywords

Low k film; Moisture adsorption; Plasma damage

Indexed keywords

ADSORPTION; ANGLE MEASUREMENT; CHEMICAL VAPOR DEPOSITION; CONTACT ANGLE; DEUTERIUM; FOURIER TRANSFORM INFRARED SPECTROSCOPY; FRICTION; GAS ADSORPTION; HEAVY WATER; METAL ANALYSIS; MOISTURE; MOISTURE CONTROL; PHOTOELECTRON SPECTROSCOPY; PLASMAS; SPECTROSCOPIC ELLIPSOMETRY; SURFACE CHEMISTRY; SURFACE ROUGHNESS; SURFACE TENSION; WATER ABSORPTION; X RAY PHOTOELECTRON SPECTROSCOPY;

ASH PROCESSES; ATOMIC FORCES; BULK PROPERTIES; DEVICE PERFORMANCES; DIIODOMETHANE; DISPERSIVE COMPONENTS; FILM DENSITIES; FILM SURFACE ENERGIES; FILM SURFACES; LOW DIELECTRIC CONSTANTS; LOW-K FILM; METAL INTRUSIONS; MOISTURE ADSORPTION; PLASMA DAMAGE; PLASMA ETCH; POROUS LOW-K DIELECTRICS; SIOCH FILMS; VERTICAL AMPLITUDES; X-RAY PHOTOELECTRON SPECTROSCOPIES;

SURFACE PROPERTIES;

EID: 58149218326     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.10.018     Document Type: Article

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