Tin pest issues in lead-free electronic solders

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 1-3, 2007, Pages 307-318

  Plumbridge, W J ^a  

^a OPEN UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL GROWTH; DISINTEGRATION; IMPURITIES; NUCLEATION; SEMICONDUCTING INTERMETALLICS; SOLDERED JOINTS; TIN ALLOYS;

LEAD-FREE SOLDERS; TIN PEST;

SOLDERING ALLOYS;

EID: 33845708649     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9025-3     Document Type: Article

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