Recent observations on tin pest formation in solder alloys

Journal of Electronic Materials

Volumn 37, Issue 2, 2008, Pages 218-223

  Plumbridge, W J ^a  

^a OPEN UNIVERSITY   (United Kingdom)

Author keywords

Allotropic transition; Lead free solder alloys; Solder joints; Structural integrity in electronics; Tin pest

Indexed keywords

ALLOTROPIC TRANSITION; LEAD-FREE SOLDER ALLOYS;

GROWTH (MATERIALS); NUCLEATION; SOLDERED JOINTS; STRESS RELAXATION; STRUCTURAL INTEGRITY; THERMAL EFFECTS;

SOLDERING ALLOYS;

EID: 37249073934     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0165-x     Document Type: Article

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