Influence of medical sterilization on ACA flip chip joints using conformal coating

Microelectronics Reliability

Volumn 49, Issue 1, 2009, Pages 92-98

  Kokko, Kati ^a   Harjunpää, Hanna ^a   Heino, Pekka ^a   Kellomäki, Minna ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVE JOINTS; ANIMAL CELL CULTURE; CHIP SCALE PACKAGES; COATINGS; CONDUCTIVE MATERIALS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; EPOXY RESINS; FLIP CHIP DEVICES; GAMMA RAYS; HEALTH CARE; LASER INTERFEROMETRY; ORGANIC POLYMERS; RELIABILITY; STERILIZATION (CLEANING);

ANISOTROPICALLY CONDUCTIVE ADHESIVES; COATED DEVICES; CONFORMAL COATINGS; CONSTANT HUMIDITIES; CURING DEGREES; FLIP CHIP TECHNOLOGIES; FLIP CHIPS; GAMMA RADIATION STERILIZATIONS; GAMMA RADIATIONS; HARSH ENVIRONMENTS; HUMAN BODIES; PARYLENE; RELIABILITY TESTS; SPACE SAVINGS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 58149129026     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.10.016     Document Type: Article

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