A test microchip for evaluation of hermetic packaging technology for biomedical prosthetic implants

Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings

Volumn 26 VI, Issue , 2004, Pages 4093-4095

  Kazemi, Mohammad ^a   Basham, Eric ^b   Sivaprakasam, Mohanasankar ^b   Wang, Guoxing ^b   Rodger, Damien ^c,d   Weiland, James ^a   Tai, Y C ^c   Liu, Wentai ^b   Humayun, Mark ^a  

^a University of Southern California ^*  (United States)

^b University of California Santa Cruz   (United States)

^c California Institute of Technology   (United States)

^d UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

Biomedical implants; Hermetic packaging; Soak testing; Test chip

Indexed keywords

BIOMEDICAL IMPLANTS; HERMETIC PACKAGING; SOAK TESTING; TEST CHIP;

AMPLIFIERS (ELECTRONIC); CAPACITANCE; CMOS INTEGRATED CIRCUITS; IMPLANTS (SURGICAL); MATHEMATICAL MODELS; MICROPROCESSOR CHIPS;

PROSTHETICS;

EID: 11144347764     PISSN: 05891019     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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