Effectiveness of conformal coatings on a PBGA subjected to unbiased high humidity, high temperature tests

Microelectronics International

Volumn 17, Issue 3, 2000, Pages 16-20

  Zhang, Kang ^a   Pecht, Michael ^b  

^a M/S M3 49   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Conformal coatings; Delamination; High temperature; Humidity; Moisture; Plastic ball grid array

Indexed keywords

EID: 0002284383     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360010352136     Document Type: Article

References (19)

1. Amagai, M. et al. (1997), "Mechanical characteristics of die attach material in ball grid array (BGA) packages", The International Journal of Microcircuits and Electronic Packaging, Vol. 20 No. 4, pp. 482-93.
2. Chew, S. (1996), "An investigation into moisture-induced cracking in plastic packages using thermal analysis techniques", Proceedings of the 22nd International Symposium for Testing and Failure Analysis, 18-22 November, Los Angeles, CA, pp. 411-15.
3. Cui, C.Q. (1997), "Improvement of adhesion between epoxy mold compound and solder resist in BGA packages", Pan Pacific Microelectronics Symposium: Proceedings of the Technical Program 1997, Maui, Hawaii, pp. 241-6.
4. Edwards, F. et al. (1999), "Effectiveness of conformal coatings as moisture barriers for PEM . Proceedings of 1999 Military/ Aerospace COTS Conference, pp. 117-26.
5. Freeman, M. (1997), "Developing guidelines for conformal coating usage", Circuits Assembly, Vol. 8 No. 7, pp. 56-61.
6. Galloway, J.E. and Miles, B.M. (1997), "Moisture absorption and desorption predictions for plastic ball grid array packages", IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A. Vol. 20 No. 3, September, pp. 274-9.
7. Hawkins, G. et al. (1994), "The PBGA: a systematic study of moisture resistance", Proceedings of the 1994 International Electronics Packaging Conference, September 25-28, Atlanta, GA, pp. 588-602.
8. IPC/JEDEf J-STD-020A (1999), Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices, April.
9. Lau, J.H. (1995), Ball Grid Array Technology, McGraw-Hill, New York, NY.
10. Parekh, K. (1996), "Package related failure mechanisms in plastic BGA packages used for ASIC devices", Proceedings of the 22nd International Symposium for Testing and Failure Analysis, pp. 269-76.
11. Pecht, M. (1999), "Moisture sensitivity characterization of build-up ball grid array substrates", IEEE Transactions on Advanced Packaging, Vol. 22 No. 3, August, pp. 515-22.
12. Pecht, M. et al. (1995), Plastic Encapsulated Microelectronics, John Wiley & Sons, New York, NY.
13. Rafanelli, A. (1998), "A review of coating techrologies with regard to reliability of plastic encapsulated microcircuits", ASME International Mechanical Engineering Congress & Exposition, pp. 1-9.
14. Robins, M. (1999), "Conformal coatings: to protect and serve", Electronic Packaging & Production, pp. 16-22.
15. Sawada, Y. et al. (1998), The Reliability of Plastic Ball Grid Array Package, 1998 IEMT/IMC, pp. 35-9.
16. Scalise, J. (1996), "Plastic encapsulated microcircuits qualification testing", 1996 Electronic Components and Technology Conference, pp. 392-7.
17. Studd, R. (1997), "A conformal coatings evolution", Surface Mount Technology, Vol. 11, pp. 48-50.
18. Tautscher, C.J. (1998), "Conformal coatings selection criteria", Surface Mount Technology, Vol. 12 No. 7, pp. 64-8.
19. Teo, Y.C. et al. (1998), "Enhancing moisture resistance of PBGA", 48th Electronic Components and Technology Conference, pp. 930-35.