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Volumn 129, Issue 3, 2007, Pages 260-265

Effect of RCC on the reliability of adhesive flip chip joints

Author keywords

Anisotropic conductive adhesive; Flip chip; FR 4; Reliability; Sequential build up process

Indexed keywords

ADHESIVE JOINTS; CHIP SCALE PACKAGES; DIELECTRIC MATERIALS; PRINTED CIRCUIT BOARDS; RELIABILITY; TEMPERATURE CONTROL;

EID: 38749141366     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2753909     Document Type: Article
Times cited : (9)

References (15)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.