Influence of medical sterilization on material systems of electronics

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 2, Issue , 2006, Pages 1252-1254

  Uhlemann, Jürgen ^a   Rudolf, Frank ^a   Meusel, Birgitt ^a   Meusel, Ekkehard ^a   Wolter, Klaus Jürgen ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; PARAMETER ESTIMATION; STERILIZATION (CLEANING);

ELECTRONIC MATERIALS; FLIP-CHIP-CONTACTS;

ELECTRONIC EQUIPMENT;

EID: 42549118461     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280171     Document Type: Conference Paper

References (5)

1. EN 45502-1:1997: Active implantable medical devices, Part 1: General requirements for safety, marking and information to be provided by the manufacturer
2. DIN EN 552:02-2001; Sterilization of medical devices - Validation and routine control of sterilization by irradiation
3. DIN EN 554:11-1994; Sterilization of medical devices - Validation and routine control of sterilization by moist heat
4. Steuer, W., Junghanns, U.: Sterilisation und Desinfektion im Krankenhaus, Vulkan Verlag Essen 1991
5. Autorenkollektiv: Prüfverfahren für Drahtbondverbindungen, Merkblatt Nr. 2811:08-1996 des Deutschen Verbandes für Schweißtechnik