-
1
-
-
0038104277
-
High Performance Fully-Depleted Tri-Gate CMOS Transistors
-
B. S. Doyle et al., "High Performance Fully-Depleted Tri-Gate CMOS Transistors," IEEE Electron Device Letters, vol.24, no 4, 2003, pp. 263-265.
-
(2003)
IEEE Electron Device Letters
, vol.24
, Issue.4
, pp. 263-265
-
-
Doyle, B.S.1
-
2
-
-
38649140309
-
Highly manufacturable FinFETs with sub-lOnm fin width and high aspect ratio fabricated with immersion lithography, in VLSI Symp
-
M.J.H. van Dal et al., "Highly manufacturable FinFETs with sub-lOnm fin width and high aspect ratio fabricated with immersion lithography," in VLSI Symp. Tech. Dig., 2007, pp. 110-111.
-
(2007)
Tech. Dig
, pp. 110-111
-
-
van Dal, M.J.H.1
-
3
-
-
85205698506
-
FinFET Performance Enhancement with Tensile Metal Gates and Strained Silicon on Insulator (sSOI) Substrate
-
W. Xiong et al., "FinFET Performance Enhancement with Tensile Metal Gates and Strained Silicon on Insulator (sSOI) Substrate," Device Research Conference, pp. 39-40, 2006.
-
(2006)
Device Research Conference
, pp. 39-40
-
-
Xiong, W.1
-
4
-
-
46049084627
-
A Novel Electrode-Induced Strain Engineering for High Performance SOI FinFET utilizing Si (110) Channel for Both N and PMOSFETs
-
C. Y. Kang "A Novel Electrode-Induced Strain Engineering for High Performance SOI FinFET utilizing Si (110) Channel for Both N and PMOSFETs," IEDM Tech. Dig., 2006, pp. 1-4.
-
(2006)
IEDM Tech. Dig
, pp. 1-4
-
-
Kang, C.Y.1
-
5
-
-
33748536739
-
Drive-Current Enhancement in FinFETs Using Gate-Induced Stress
-
K-M. Tan et al., Drive-Current Enhancement in FinFETs Using Gate-Induced Stress," IEEE Electron Device Letters, vol.27, no 9, 2006, pp. 769-771.
-
(2006)
IEEE Electron Device Letters
, vol.27
, Issue.9
, pp. 769-771
-
-
Tan, K.-M.1
-
6
-
-
50249095101
-
Gate stacks for scalable high-performance FinFETs
-
G. Vellianitis et al., "Gate stacks for scalable high-performance FinFETs," IEDM Tech. Dig., 2007, pp. 684-684.
-
(2007)
IEDM Tech. Dig
, pp. 684-684
-
-
Vellianitis, G.1
-
7
-
-
33745139143
-
Tall triple gate devices with TiN/Hf02 gate stack, in VLSI Symp
-
N. Collaert et al., "Tall triple gate devices with TiN/Hf02 gate stack," in VLSI Symp. Tech. Dig., 2005, pp. 108-109.
-
(2005)
Tech. Dig
, pp. 108-109
-
-
Collaert, N.1
-
8
-
-
34249823840
-
4 as precursor
-
Seoul, Korea, July 24-26
-
th International Conference on Atomic Layer Deposition, Seoul, Korea, July 24-26, 2006.
-
(2006)
th International Conference on Atomic Layer Deposition
-
-
Swerts, J.1
Maes, J.W.2
Milligan, B.3
Lee, F.4
Marcus, S.5
Genechten, D.V.6
Kottantharayil, A.7
-
9
-
-
43549095410
-
Threshold voltage modulation in FinFET devices through Arsenic Ion Implantation into TiN/HfSiON gate stack
-
L. Witters et al., "Threshold voltage modulation in FinFET devices through Arsenic Ion Implantation into TiN/HfSiON gate stack," IEEE International SOI Conf. Proc, 2007, pp. 31-32.
-
(2007)
IEEE International SOI Conf. Proc
, pp. 31-32
-
-
Witters, L.1
-
10
-
-
33947623056
-
-
R. Singanamalla et al., Electrical and material evaluation of the MOCVD TiN as metal gate electrode for advanced CMOS technology, MRS Symposium Proc, 917 E, 2006.
-
R. Singanamalla et al., "Electrical and material evaluation of the MOCVD TiN as metal gate electrode for advanced CMOS technology," MRS Symposium Proc, Vol. 917 E, 2006.
-
-
-
-
11
-
-
33646262581
-
On the impact of TiN film thickness variations on the effective work function of Poly-Si/TiN/HfSiON gate stacks
-
R. Singanamalla et al., "On the impact of TiN film thickness variations on the effective work function of Poly-Si/TiN/HfSiON gate stacks," IEEE Electron Device Letters, vol. 27, no 5, 2006, pp. 332-334.
-
(2006)
IEEE Electron Device Letters
, vol.27
, Issue.5
, pp. 332-334
-
-
Singanamalla, R.1
-
12
-
-
33751428888
-
The Effect of Metal Thickness, Overlayer and High-k Surface Treatment on the Effective Work Function of Metal Electrode
-
K. Choi et al., "The Effect of Metal Thickness, Overlayer and High-k Surface Treatment on the Effective Work Function of Metal Electrode," ESSDERC Proc, 2005, pp. 101-104.
-
(2005)
ESSDERC Proc
, pp. 101-104
-
-
Choi, K.1
-
13
-
-
0033732282
-
An Analytical Solution to a Double-Gate MOSFET with Undoped Body
-
Y. Taur, "An Analytical Solution to a Double-Gate MOSFET with Undoped Body," IEEE Electron Device Letters, vol. 21, no 5, 2000, pp. 245-247.
-
(2000)
IEEE Electron Device Letters
, vol.21
, Issue.5
, pp. 245-247
-
-
Taur, Y.1
-
14
-
-
34250671643
-
Solid phase epitaxy versus random nucleation and growth in sub-20 nm wide fin field-effect transistors
-
June
-
R. Duffy et al., "Solid phase epitaxy versus random nucleation and growth in sub-20 nm wide fin field-effect transistors", Appl. Phys. Lett., vol. 90, 241912, June 2007.
-
(2007)
Appl. Phys. Lett
, vol.90
, pp. 241912
-
-
Duffy, R.1
-
15
-
-
84896741951
-
Surface states at steam-grown silicon-silicon dioxide interfaces
-
C. N. Berglund, "Surface states at steam-grown silicon-silicon dioxide interfaces," IEEE Trans. Electron Devices, vol. 13, no. 10, 1966, pp. 701-705
-
(1966)
IEEE Trans. Electron Devices
, vol.13
, Issue.10
, pp. 701-705
-
-
Berglund, C.N.1
|