High-etch-rate bottom-antireflective coating and gap fill materials using dextrin derivatives in via first dual-damascene lithography process

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6923, Issue , 2008, Pages

  Takei, Satoshi ^a   Sakaida, Yasushi ^a   Shinjo, Tetsuya ^a   Hashimoto, Keisuke ^a   Nakajima, Yasuyuki ^a  

^a NISSAN CHEMICAL INDUSTRIES LTD   (Japan)

Author keywords

BARC; Bottom antireflective coating; Dual damascene; Gap fill material; High etch rate; Planarization

Indexed keywords

ANTIREFLECTION COATINGS; COPPER; ESTERS; ETHYLENE GLYCOL; GALLIUM ALLOYS; GLYCOLS; LITHOGRAPHY; PHOTORESISTS; PROPYLENE;

BARC; BOTTOM ANTIREFLECTIVE COATING; DUAL DAMASCENE; GAP FILL MATERIAL; HIGH ETCH RATE; PLANARIZATION;

REACTIVE ION ETCHING;

EID: 57349091155     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.771902     Document Type: Conference Paper

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