Novel approach of UV cross- Link process for advanced planarization technology in 32-45 nm lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6519, Issue PART 2, 2007, Pages

  Takei, Satoshi ^a   Horiguchi, Yusuke ^a   Shinjo, Tetsuya ^a   Bang Ching, Ho ^a   Mano, Yuichi ^a   Nakajima, Yasuyuki ^a   Muramatsu, Makoto ^b   Iwashita, Mitsuaki ^b   Tsuchiya, Katsuhiro ^b  

^a NISSAN CHEMICAL INDUSTRIES LTD   (Japan)

^b TOKYO ELECTRON LTD   (Japan)

Author keywords

Dual damascene; Lithography; Planarization; UV cross link materials; XUV

Indexed keywords

CROSSLINKING; DRY ETCHING; LITHOGRAPHY; ULTRAVIOLET RADIATION;

DUAL DAMASCENE; PHOTO IRRADIATION; PLANARIZATION; UV CROSSLINK MATERIALS;

PHOTORESISTS;

EID: 35148890359     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.711362     Document Type: Conference Paper

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