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Volumn 26, Issue 6, 2008, Pages 1834-1840

Fabrication and testing of through-silicon vias used in three-dimensional integration

Author keywords

[No Author keywords available]

Indexed keywords

BOSCH PROCESSES; CONFORMAL COVERAGES; CU ELECTROPLATING; DEEP REACTIVE ION ETCH; ELECTRICAL PERFORMANCES; INTERCONNECT SCHEMES; LINING MATERIALS; METAL SEEDS; SCANNING ELECTRON MICROSCOPES; SECTIONAL VIEWS; SEED LAYERS; SIDE-WALLS; SIDEWALL ANGLES; SILICON SUBSTRATES; SILICON VIAS; STACKING TECHNOLOGIES;

EID: 57249086410     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2993174     Document Type: Article
Times cited : (24)

References (20)
  • 1
    • 57249111326 scopus 로고    scopus 로고
    • IBM Press Release, April.
    • IBM Press Release, http://www-03.ibm.com/press/us/en/index.wss April 2007.
    • (2007)
  • 2
    • 57249101073 scopus 로고    scopus 로고
    • MRS Symposia Proceedings No. 970 (Materials Research Society, Pittsburgh).
    • B. Kim, Enabling Technologies for 3-D Integration, MRS Symposia Proceedings No. 970 (Materials Research Society, Pittsburgh, 2006).
    • (2006) Enabling Technologies for 3-D Integration
    • Kim, B.1
  • 3
    • 57249093248 scopus 로고    scopus 로고
    • Proceedings of the IMAPS International Conference on Device Packaging, Scottsdale, AZ.
    • S. Polamreddy, S. Spiesshoefer, R. Figueroa, L. Schaper, and S. Burkett, Proceedings of the IMAPS International Conference on Device Packaging, Scottsdale, AZ, 2005.
    • (2005)
    • Polamreddy, S.1    Spiesshoefer, S.2    Figueroa, R.3    Schaper, L.4    Burkett, S.5
  • 5
    • 57249093250 scopus 로고    scopus 로고
    • Proceedings of the IEEE Custom Integrated Circuits Conference,.
    • J. U. Knickerbocker, Proceedings of the IEEE Custom Integrated Circuits Conference, 2005, p. 659.
    • (2005) , pp. 659
    • Knickerbocker, J.U.1
  • 6
    • 33845598283 scopus 로고    scopus 로고
    • Proceedings of the 56th IEEE Electronic Components and Technology Conference, San Diego, California,.
    • B. Kim, C. Sharbono, T. Ritzdorf, and D. Schmauch, Proceedings of the 56th IEEE Electronic Components and Technology Conference, San Diego, California, 2006, p. 838.
    • (2006) , pp. 838
    • Kim, B.1    Sharbono, C.2    Ritzdorf, T.3    Schmauch, D.4
  • 7
    • 57249102517 scopus 로고    scopus 로고
    • Proceedings of the 56th IEEE Electronic Components and Technology Conference, San Diego, California,.
    • R. Nagarajan, L. Ebin, L. Dayong, S. C. Seng, K. Prasad, and N. Balasubramanian, Proceedings of the 56th IEEE Electronic Components and Technology Conference, San Diego, California, 2006, p. 383.
    • (2006) , pp. 383
    • Nagarajan, R.1    Ebin, L.2    Dayong, L.3    Seng, S.C.4    Prasad, K.5    Balasubramanian, N.6
  • 8
    • 25844518945 scopus 로고    scopus 로고
    • Proceedings of the International Symposium Electronic Materials and Packaging,.
    • A. Okuno and N. Fujita, Proceedings of the International Symposium Electronic Materials and Packaging, 2002, p. 133.
    • (2002) , pp. 133
    • Okuno, A.1    Fujita, N.2
  • 10
    • 77950833728 scopus 로고    scopus 로고
    • Proceedings of the International Symposium on Electronic Materials and Packaging,.
    • A. Okuno, Proceedings of the International Symposium on Electronic Materials and Packaging 2000, p. 143.
    • (2000) , pp. 143
    • Okuno, A.1
  • 11
    • 33845567960 scopus 로고    scopus 로고
    • Proceedings of the 56th IEEE Electronic Components and Technology Conference, San Diego, California,.
    • P. Dixit and J. Miao, Proceedings of the 56th IEEE Electronic Components and Technology Conference, San Diego, California, 2006, p. 388.
    • (2006) , pp. 388
    • Dixit, P.1    Miao, J.2
  • 13
    • 57249101077 scopus 로고    scopus 로고
    • M.S. thesis, The University of Arkansas.
    • T. Lam, M.S. thesis, The University of Arkansas, 2006.
    • (2006)
    • Lam, T.1
  • 14
    • 35348913683 scopus 로고    scopus 로고
    • Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada,.
    • W. Worwag and T. Dory, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, 2007, p. 842.
    • (2007) , pp. 842
    • Worwag, W.1    Dory, T.2
  • 19
    • 28344438539 scopus 로고    scopus 로고
    • Proceedings of the Advanced Metallization Conference,.
    • H. Huebner, Proceedings of the Advanced Metallization Conference, 2002, p. 53.
    • (2002) , pp. 53
    • Huebner, H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.