Wafer level CSP process by VPES (vacuum printing encapsulation systems)

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 143-151

  Okuno, Atsushi ^a  

^a Japan Rec Co   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; EPOXY RESINS; MODIFIED ATMOSPHERE PACKAGING; MOLDING; PACKAGING; PRINTING; RELIABILITY; RESIN TRANSFER MOLDING;

ADHESIVE STRENGTH; CERAMIC SUBSTRATES; COATING METHODS; HIGH RELIABILITY; INSULATING LAYERS; PACKAGING METHODS; VPES (VACUUM PRINTING ENCAPSULATION SYSTEMS); WAFER LEVEL CSP;

ELECTRONICS PACKAGING;

EID: 77950833728     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904144     Document Type: Conference Paper

References (8)

1. Atsushi Okuno, etc. 'New Packaging of Chip on Board by Uniquie Printing Method", IEEE Transactions on Components, Hybrides, and Manufacturing Technology, Vol. 15, No. 1, pp. 73-77, Feb., 1992.
2. Atsushi Okuno, etc, "Printing Encapsulation Systems (PES) of Advanced Mulitichip Module and COB Device", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 17, No. 1, pp. 143-150, 1994.
3. Atsushi Okuno, etc, "PES (Printing Encapsulation Systems) of some BGA Packaging", ISHM'96 Proceedings, pp. 103-106, 1994.
4. Atsushi Okuno, etc, "Properties and Reliability of Liquid Epoxy Resin for LSI Fabrication with PES (Printing Encapsulation Systems)", Electronics and Communications in Japan, Part 2, Vol. J79-C-I, No. 9, pp. 431-439, Sept., 1996.
5. Atsushi Okuno, "Flip-chip Packaging using PES (Printing Encapsulation Systems) and PES's Underfill Epoxy Resin", 45th Electronic Components & Technology Conference, pp. 1240-1243, May 1995.
6. Atsushi Okuno, etc, US P 5, 232,651
7. Atsushi Okuno, etc, JP P H3-145750
8. Atsushi Okuno, "High Reliability, High Density, Low Cost Packaging Systems for Matrix BGA and CSP using VPES (Vacuum Printing Encapsulation Systems)", 48th Electronic Components & Technology Conference, pp. 109-110, May, 1998.