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Volumn 970, Issue , 2007, Pages
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Enabling Technologies for 3-D Integration
[No Author Info available]
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Author keywords
[No Author keywords available]
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Indexed keywords
AUTOMOTIVE ENGINEERING;
CMOS INTEGRATED CIRCUITS;
COMPUTER SIMULATION;
MICROPROCESSOR CHIPS;
SEMICONDUCTOR STORAGE;
SILICON;
DETECTOR ARRAYS;
PARASITIC EFFECTS;
SCALING LIMITS;
STACKED SILICON;
INTEGRATED CIRCUIT LAYOUT;
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EID: 34250900894
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Review |
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Times cited : (2)
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References (0)
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