Filling the via hole of IC by VPES (vacuum printing encapsulation systems) for stacked chip (3D packaging)

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 133-138

  Okuno, A ^a   Fujita, Noriko ^b  

^a Sanyu Rec Co Ltd   (Japan)

^b SANYU REC Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CHIP SCALE PACKAGES; FILLING; INTEGRATED CIRCUITS; MODIFIED ATMOSPHERE PACKAGING; PACKAGING; PRINTING;

3D PACKAGING; CONDUCTIVE PASTES; NON CONDUCTIVE PASTES; NONCONDUCTIVE PASTE; PRINTING CONDITIONS; VACUUM CONDITION; VPES (VACUUM PRINTING ENCAPSULATION SYSTEMS); WAFER STACKING;

ELECTRONICS PACKAGING;

EID: 25844518945     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188826     Document Type: Conference Paper

References (18)

1. A.Okuno,et al.: New Packaging of chip on board by unique printing method, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.15, No.1,p73(Feb.,1992)
2. A. Okuno, et al.: PES (Printing Encapsulation Systems) of some BGA Packaging. ISHM '96. Proceedings. P103 (1994)
3. th, Electronic Components & Technology Conference, p.1240 (May, 1995)
4. th, Electronic Components & Technology Conference, p. 109 (May, 1998)
5. A. Okuno, et al.: Wafer level CSP by VPES (Vacuum Printing Encapsulation Systems), Electronics & Materials, P109. (Aug., 2000)
6. A. Okuno, et al.: JP P.2519477
7. A. Okuno, et al.: JP P.2036659
8. A. Okuno, et al.: JP P.2807838
9. A. Okuno and N. Oyama et al.: JP P.3113974
10. A. Okuno and N. Oyama et al.: JP P.2824569
11. A. Okuno, et al.: JP P.3128612
12. A. Okuno and N. Oyama et al.: JP P.1937699
13. A. Okuno and N. Oyama et al.: JP P.2928755
14. A. Okuno and N. Oyama et al.: JP P.3084440
15. A. Okuno and N. Oyama et al.: JP P.2726023
16. A. Okuno and N. Oyama et al.: JP P.2851589
17. A. Okuno and N. Oyama et al.: JP P.3084021
18. A. Okuno and N. Oyama et al.: US P.5,232,651