Thermal stability of Ni-Pt-Ta alloy silicides on epi-Si1-xCx

Materials Science and Engineering: B

Volumn 154-155, Issue 1-3, 2008, Pages 183-186

  Yoo, Jung Ho ^a   Chang, Hyun Jin ^a   Min, Byoung Gi ^a,b   Ko, Dae Hong ^a   Cho, Mann Ho ^a   Sohn, Hyunchul ^a   Lee, Tae Wan ^b  

^a Yonsei University   (South Korea)

^b Jusung Engineering Company Limited   (South Korea)

Author keywords

Epi Si1 xCx; Ni alloy silicide; Thermal stability

Indexed keywords

BINARY ALLOYS; GRAIN BOUNDARIES; NICKEL ALLOYS; PLATINUM ALLOYS; SILICON ALLOYS; SYSTEM STABILITY; TANTALUM ALLOYS; TERNARY ALLOYS; THERMODYNAMIC STABILITY;

EPI-SI1-XCX; MAGNETRON-SPUTTERING; NI ALLOY SILICIDE; NI ALLOYS; NI-SI SYSTEM; NI-SILICIDE; SI SUBSTRATES; SILICIDE FORMATION; SILICIDE LAYERS; TA FILMS;

SILICIDES;

EID: 56949096094     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2008.10.012     Document Type: Article

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