In situ compression tests on micro-sized silicon pillars by Raman microscopy - Stress measurements and deformation analysis

Journal of Materials Research

Volumn 23, Issue 11, 2008, Pages 3040-3047

  Wasmer, Kilian ^a   Wermelinger, T ^b   Bidiville, A ^a   Spolenak, R ^b   Michler, J ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BIOMECHANICS; BUILDING MATERIALS; COMPRESSION TESTING; COMPRESSIVE STRENGTH; CRACK DETECTION; CRACK TIPS; CRACKS; DATA COMPRESSION; ELECTROMECHANICAL DEVICES; INSTRUMENTS; MECHANICAL PROPERTIES; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSCOPIC EXAMINATION; PLANTS (BOTANY); RAMAN SCATTERING; RAMAN SPECTROSCOPY; SILICON; STRESS MEASUREMENT; STRESSES;

COMPRESSIVE FAILURES; CRACK FORMATIONS; DEFORMATION ANALYSES; DISLOCATION ACTIVITIES; IN-SITU; LOAD CELLS; MICRO PILLARS; MICRO-ELECTRO-MECHANICAL SYSTEMS; PLANE STRESSES; RAMAN MICROSCOPIES; RAMAN PEAK SHIFTS; RAMAN SPECTRUMS; SET-UPS; SILICON PILLARS; STRUCTURAL MATERIALS; UNIAXIAL STRESSES;

PLASMA DIAGNOSTICS;

EID: 56549108086     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2008.0363     Document Type: Article

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