메뉴 건너뛰기




Volumn 47, Issue 5 PART 1, 2008, Pages 3412-3417

Development of developer-soluble gap fill materials for planarization in via-first dual damascene process

Author keywords

Dual damascene; Etch rate; Gap fill materials; Lithography; Planarization

Indexed keywords

ABS RESINS; ANTIREFLECTION COATINGS; CLEANING; CONCENTRATION (PROCESS); DISSOLUTION; GALLIUM ALLOYS; LITHOGRAPHY; METAL RECOVERY; PHENOLS; PHOTORESISTS; RATE CONSTANTS; THROUGHPUT;

EID: 55049095501     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.3412     Document Type: Article
Times cited : (2)

References (12)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.