Characterization of gap fill materials for planarizing substrate in via-first dual damascene lithography process

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 46, Issue 9 A, 2007, Pages 5755-5761

  Takei, Satoshi ^a   Sakaida, Yasushi ^a   Shinjo, Tetsuya ^a  

^a NISSAN CHEMICAL INDUSTRIES LTD   (Japan)

Author keywords

Dual damascene; Gap fill materials; Lithography; Planarization; Thermal cross link materials; Voids free coating

Indexed keywords

CROSSLINKING; DRY ETCHING; LITHOGRAPHY; POLYMER SOLUTIONS; REACTION RATES; SUBSTRATES;

DUAL DAMASCENE; GAP FILL MATERIALS; PLANARIZATION; THERMAL CROSS-LINK MATERIALS; VOIDS-FREE COATINGS;

GAS MIXTURES;

EID: 34548734820     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.46.5755     Document Type: Article

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