Modeling of plated through-hole processes: II. Effect of leveling agents on current distribution

Journal of the Electrochemical Society

Volumn 143, Issue 10, 1996, Pages 3144-3148

  Chern, Ja Wern E ^a   Cheh, Huk Y ^a  

^a Och Spine at New York Presbyterian Hospitals   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION ISOTHERMS; AGENTS; CALCULATIONS; DIFFUSION; ELECTRIC CURRENT DISTRIBUTION; ELECTRODEPOSITION; MASS TRANSFER; REACTION KINETICS;

LANGMUIR ADSORPTION ISOTHERMS; LEVELING AGENTS; MASS TRANSFER MECHANISM; PLATED THROUGH HOLE PROCESSES; SURFACE CONCENTRATION;

MATHEMATICAL MODELS;

EID: 0030259055     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837177     Document Type: Article

References (12)

1. J. E. Chern and H. Y. Cheh, This Journal, 143, 3139 (1996).
2. D. R. Turner and G. R. Johnson, ibid., 109, 918 (1962).
3. L. Karasyk and H. B. Linford, ibid., 110, 895 (1962).
4. J. D. Thomas, Proceedings AES 43rd Annual Conference, p. 60-66 (1956).
5. O. Kardos, Plating, 61, 129 (1974).
6. O. Kardos, ibid., 61, 229 (1974).
7. O. Kardos, ibid., 61, 316 (1974).
8. D. A. Hazlebeck and J. B. Talbot, AIChE J., 36, 1145 (1990).
9. J. E. Chern and H. Y. Cheh, Chem. Eng. Commun., 114, 191 (1992).
10. J. E. Chern and H. Y. Cheh, ibid., 114, 175 (1992).
11. H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids, 2nd ed., Oxford University Press, Oxford, England (1959).
12. A. Acrivos and P. L. Chambré, Ind. Eng. Chem., 49, 1025 (1957).