-
1
-
-
0032073125
-
High-Q capacitors implemented in a CMOS process for low-power wireless applications
-
C.-M. Hung, Y.-C. Ho, and I.-C. Wu, "High-Q capacitors implemented in a CMOS process for low-power wireless applications," in Proc. IEEE MTT-S Int. Microw. Symp. Dig., 1998, pp. 505-511.
-
(1998)
Proc. IEEE MTT-S Int. Microw. Symp. Dig
, pp. 505-511
-
-
Hung, C.-M.1
Ho, Y.-C.2
Wu, I.-C.3
-
2
-
-
0035339020
-
Analog characteristics of metal-insulator-metal capacitors using PECVD nitride dielectrics
-
May
-
J. A. Babcock, S. G. Balster, A. Pinto, C. Dirnecker, P. Steinmann, R. Jumpertz, and B. El-Kareh, "Analog characteristics of metal-insulator-metal capacitors using PECVD nitride dielectrics," IEEE Electron Device Lett., vol. 22, no. 5, pp. 230-232, May 2001.
-
(2001)
IEEE Electron Device Lett
, vol.22
, Issue.5
, pp. 230-232
-
-
Babcock, J.A.1
Balster, S.G.2
Pinto, A.3
Dirnecker, C.4
Steinmann, P.5
Jumpertz, R.6
El-Kareh, B.7
-
3
-
-
0042888789
-
Characterization and comparison of PECVD silicon nitride and silicon oxynitride dielectric for MIM capacitors
-
Aug
-
C. H. Ng, K. W. Chew, and S. E Chu, "Characterization and comparison of PECVD silicon nitride and silicon oxynitride dielectric for MIM capacitors," IEEE Electron Device Lett., vol. 24, no. 8, pp. 506-508, Aug. 2003.
-
(2003)
IEEE Electron Device Lett
, vol.24
, Issue.8
, pp. 506-508
-
-
Ng, C.H.1
Chew, K.W.2
Chu, S.E.3
-
4
-
-
0036923873
-
High-capacitance Cu/Ta205/Cu MIM structure for SoC applications featuring a single-mask add-on process
-
T. Ishikawa, D. Kodama, Y. Matsui, M. Hiratani, T. Furusawa, and D. Hisamoto, "High-capacitance Cu/Ta205/Cu MIM structure for SoC applications featuring a single-mask add-on process," in IEDM Tech. Dig., 2002, pp. 940-942.
-
(2002)
IEDM Tech. Dig
, pp. 940-942
-
-
Ishikawa, T.1
Kodama, D.2
Matsui, Y.3
Hiratani, M.4
Furusawa, T.5
Hisamoto, D.6
-
5
-
-
0036540809
-
x dielectrics
-
Apr
-
x dielectrics," IEEE Electron Device Lett., vol. 23, no. 4, pp. 185-187, Apr. 2002.
-
(2002)
IEEE Electron Device Lett
, vol.23
, Issue.4
, pp. 185-187
-
-
Chen, S.B.1
Lai, J.H.2
Chin, A.3
Hsieh, J.C.4
Liu, J.5
-
6
-
-
0036539415
-
3 gate dielectrics from TF to RF frequency range
-
Apr
-
3 gate dielectrics from TF to RF frequency range," IEEE Electron Device Lett., vol. 23, no. 4, pp. 203-205, Apr. 2002.
-
(2002)
IEEE Electron Device Lett
, vol.23
, Issue.4
, pp. 203-205
-
-
Chen, S.B.1
Lai, J.H.2
Chan, K.T.3
Chin, A.4
Hsieh, J.C.5
Liu, J.6
-
7
-
-
0037718406
-
2 dielectrics
-
Feb
-
2 dielectrics," IEEE Electron Device Lett., vol. 24, no. 2, pp. 63-65, Feb. 2003.
-
(2003)
IEEE Electron Device Lett
, vol.24
, Issue.2
, pp. 63-65
-
-
Yu, X.1
Zhu, C.2
Hu, H.3
Chin, A.4
Li, M.F.5
Cho, B.J.6
Kwong, D.-L.7
Foo, P.D.8
Yu, M.B.9
-
8
-
-
17644439382
-
3 laminate MIM capacitors by ALD for RF and mixed signal IC applications
-
3 laminate MIM capacitors by ALD for RF and mixed signal IC applications," in IEDM Tech. Dig., 2003, pp. 379-382.
-
(2003)
IEDM Tech. Dig
, pp. 379-382
-
-
Hu, H.1
Ding, S.J.2
Lim, H.F.3
Zhu, C.4
Li, M.F.5
Kim, S.J.6
Yu, X.F.7
Chen, J.H.8
Yong, Y.F.9
Cho, B.J.10
Chan, D.S.H.11
Rustagi, S.C.12
Yu, M.B.13
Tung, C.H.14
Du, A.15
My, D.16
Fu, P.D.17
Chin, A.18
Kwong, D.L.19
-
9
-
-
0141538337
-
2 MIM capacitors for RF/mixed IC applications
-
2 MIM capacitors for RF/mixed IC applications," in VLSI Symp. Tech. Dig., 2003, pp. 77-78.
-
(2003)
VLSI Symp. Tech. Dig
, pp. 77-78
-
-
Kim, S.J.1
Cho, B.J.2
Li, M.-F.3
Zhu, C.4
Chin, A.5
Kwong, D.L.6
-
10
-
-
33745156470
-
5-hased MIM capacitors for brute RF IC applications
-
5-hased MIM capacitors for brute RF IC applications," in VLSI Symp. Tech. Dig., 2005, pp. 56-57.
-
(2005)
VLSI Symp. Tech. Dig
, pp. 56-57
-
-
Kim, S.J.1
Cho, B.J.2
Yu, M.B.3
Li, M.-F.4
Xiong, Y.-Z.5
Zhu, C.6
Chin, A.7
Kwong, D.L.8
-
11
-
-
27144453436
-
Very high-κ, and high density TiTaO MIM capacitors for analog and RF applications
-
K. C. Chiang, A. Chin, C. H. Lai, W. J. Chen, C. F. Cheng, B. F. Hung, and C. C. Liao, "Very high-κ, and high density TiTaO MIM capacitors for analog and RF applications," in VLSI Symp. Tech. Dig., 2005, pp. 62-63.
-
(2005)
VLSI Symp. Tech. Dig
, pp. 62-63
-
-
Chiang, K.C.1
Chin, A.2
Lai, C.H.3
Chen, W.J.4
Cheng, C.F.5
Hung, B.F.6
Liao, C.C.7
-
12
-
-
27144496148
-
Very high density (23 fF/μm2) RF MIM capacitors using high-κ TiTaO as the dielectric
-
Oct
-
K. C. Chiang, C. H. Lai, A. Chin, T. J. Wang, H. F. Chiu, J. R. Chen, S. P. McAlister, and C. C. Chi, "Very high density (23 fF/μm2) RF MIM capacitors using high-κ TiTaO as the dielectric," IEEE Electron Device Lett., vol. 26, no. 10, pp. 728-730, Oct. 2005.
-
(2005)
IEEE Electron Device Lett
, vol.26
, Issue.10
, pp. 728-730
-
-
Chiang, K.C.1
Lai, C.H.2
Chin, A.3
Wang, T.J.4
Chiu, H.F.5
Chen, J.R.6
McAlister, S.P.7
Chi, C.C.8
-
13
-
-
36648998773
-
improved high-temperature leakage in high-density MIM capacitors by using a TiLaO dielectric and an it electrode
-
Dec
-
C. H. Cheng, H. C. Pan, H. J. Yang, C. N. Hsiao, C. P. Chou, S. P. McAlister, and A. Chin, "improved high-temperature leakage in high-density MIM capacitors by using a TiLaO dielectric and an it electrode," IEEE Electron Device Lett., vol. 28, no. 12, pp. 1095-1097, Dec. 2007.
-
(2007)
IEEE Electron Device Lett
, vol.28
, Issue.12
, pp. 1095-1097
-
-
Cheng, C.H.1
Pan, H.C.2
Yang, H.J.3
Hsiao, C.N.4
Chou, C.P.5
McAlister, S.P.6
Chin, A.7
-
14
-
-
34547756133
-
3/TaN capacitors for analog and RF applications
-
3/TaN capacitors for analog and RF applications," in VLSI Symp. Tech. Dig., 2006, pp. 126-127.
-
(2006)
VLSI Symp. Tech. Dig
, pp. 126-127
-
-
Chiang, K.C.1
Huang, C.C.2
Chin, A.3
Chen, W.J.4
Kao, H.L.5
Hong, M.6
Kwo, J.7
-
15
-
-
33846009621
-
3 metal-insulator-metal capacitors for analog applications
-
Sep
-
3 metal-insulator-metal capacitors for analog applications," IEEE Trans. Electron Devices vol. 53, no. 9, pp. 2312-2319, Sep. 2006.
-
(2006)
IEEE Trans. Electron Devices
, vol.53
, Issue.9
, pp. 2312-2319
-
-
Chiang, K.C.1
Huang, C.C.2
Chin, A.3
Chen, G.L.4
Chen, W.J.5
Wu, Y.H.6
McAlister, S.P.7
-
16
-
-
85008035323
-
High-temperature leakage improvement in metal-insulator-metal capacitors by work-function tuning
-
Mar
-
K. C. Chiang, C. H. Cheng, H. C. Pan, C. N. Hsiao, C. P. Chou, A. Chin, and H. L. Hwang, "High-temperature leakage improvement in metal-insulator-metal capacitors by work-function tuning," IEEE Electron Device Lett., vol. 28, no. 3, pp. 235-237, Mar. 2007.
-
(2007)
IEEE Electron Device Lett
, vol.28
, Issue.3
, pp. 235-237
-
-
Chiang, K.C.1
Cheng, C.H.2
Pan, H.C.3
Hsiao, C.N.4
Chou, C.P.5
Chin, A.6
Hwang, H.L.7
-
17
-
-
34948862160
-
-
0.5 MIS capacitor with good retention, IEEE Electron Device Lett., 28, no. 10, pp. 913-915, Oct. 2007.
-
0.5 MIS capacitor with good retention," IEEE Electron Device Lett., vol. 28, no. 10, pp. 913-915, Oct. 2007.
-
-
-
-
18
-
-
33847643918
-
Lanthanide and Ir-based dual metalgate/HfAlON CMOS with large work-function difference
-
D. S. Yu. A. Chin, C. H. Wu, M.-F. Li, C. Zhu, S. J. Wang, W. J. Yoo, B. F. Hung, and S. P. McAlister, "Lanthanide and Ir-based dual metalgate/HfAlON CMOS with large work-function difference," in IEDM Tech. Dig. 2005, pp. 649-652.
-
(2005)
IEDM Tech. Dig
, pp. 649-652
-
-
Chin, D.S.Y.A.1
Wu, C.H.2
Li, M.-F.3
Zhu, C.4
Wang, S.J.5
Yoo, W.J.6
Hung, B.F.7
McAlister, S.P.8
|