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Journal of Materials Research

Volumn 16, Issue 6, 2001, Pages 1651-1659

Interfacial embrittlement by bismuth segregation in copper/tin–bismuth Pb-free solder interconnect

(2) Liu, P L a Shang, J K a

a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DUCTILE FRACTURE; EMBRITTLEMENT; FRACTURE MECHANICS; INTERFACES (MATERIALS); INTERMETALLICS; MECHANICAL PROPERTIES; MICROCRACKS; MONOLAYERS; SEGREGATION (METALLOGRAPHY); SOLDERING ALLOYS; THERMOANALYSIS;

FRACTURE RESISTANCE; MICROCHEMISTRY; THERMAL AGING;

BISMUTH COMPOUNDS;

EID: 0035382236 PISSN: 08842914 EISSN: None Source Type: Journal
DOI: 10.1557/JMR.2001.0229 Document Type: Article

Times cited : (83)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.