High-fidelity formation of a molecular-junction device using a thickness-controlled bilayer architecture

Small

Volumn 4, Issue 9, 2008, Pages 1399-1405

  Bang, Gyeong Sook ^a   Chang, Hojong ^a   Koo, Ja Ryong ^a   Lee, Takhee ^b   Advincula, Rigoberto C ^c   Lee, Hyoyoung ^a  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^b Gwangju Institute of Science and Technology (GIST)   (South Korea)

^c University of Houston   (United States)

Author keywords

Bilayers; Molecular electronics; Molecular junctions; Monolayers; Self assembly

Indexed keywords

ELECTROLYSIS; ELECTRONICS INDUSTRY; GOLD; METALLIZING; MICROELECTRONICS; MISSILE BASES; MOLECULAR ELECTRONICS; NANOTECHNOLOGY; SELF ASSEMBLED MONOLAYERS; SELF ASSEMBLY; SURFACE DIFFUSION; SURFACE ROUGHNESS; WEIGHT CONTROL;

AD LAYERS; BIFUNCTIONAL; BILAYER ARCHITECTURE; BILAYERS; HETERO STRUCTURES; HIGH-FIDELITY; METAL ELECTRODES; METAL PARTICLES; MOLECULAR JUNCTIONS; MOLECULAR LAYERS; MONOLAYERS;

METALS;

GOLD; NANOMATERIAL; ORGANIC COMPOUND;

ARTICLE; CHEMICAL STRUCTURE; CHEMISTRY; ELECTRON; SCANNING ELECTRON MICROSCOPY; SPECTROSCOPY; ULTRASTRUCTURE;

ELECTRONS; GOLD; MICROSCOPY, ELECTRON, SCANNING; MOLECULAR STRUCTURE; NANOSTRUCTURES; ORGANIC CHEMICALS; SPECTRUM ANALYSIS;

EID: 52649127945     PISSN: 16136810     EISSN: 16136829     Source Type: Journal    
DOI: 10.1002/smll.200701232     Document Type: Article

References (30)

1. D. K. Aswal, S. Lenfant, D. Guerin, J. V. Yakhmi, Anal. Chim. Acta 2006, 568, 84.
2. R. L. Carroll, C. B. Gorman, Angew. Chem. Int. Ed. 2002, 41, 4378.
3. J. Christopher Love, L. A. Estroff, J. K. Kriebel, R. G. Nuzzo, G. M. Whiesides, Chem. Rev. 2005, 205, 1103.
4. G. J. Ashwell, J. R. Sambles, A. S. Martin, W. G. Parker, M. Szablewski, J. Chem. Soc. Chem. Commun. 1990, 19, 1374.
5. R. M. Metzger, Chem. Rev. 2003, 103, 3803.
6. E. E. Polymeropoulos, J. Sagiv, J. Chem. Phys. 1978, 69, 1836.
7. C. Zhou, M. R. Deshpande, M. A. Reed, L. Jones, J. M. Tour, Appl. Phys. Lett. 1997, 71, 611.
8. A. S. Martin, J. R. Sambles, G. J. Ashwell, Phys. Rev. Lett. 1993, 70, 218.
9. J. Chen, M. A. Reed, A. M. Rawlett, J. M. Tour, Science 1999, 286, 1550.
10. Z. J. Donhauser, B. A. Mantooth, K. F. Kelly, L A. Bumm, J. D. Monnell, J. J. Stapleton, J. D. W. Price, A. M. Rawlett, D. L. Allara, J. M. Tour, P. S. Weiss, Science 2001, 292, 2303.
11. C. N. Lau, D. R. Stewart. R. S. Williams, M. Bockrath, Nano Lett. 2004, 4, 569.
12. Z. Liu, A. A. Yasseri, J. S. Lindsey, D. F. Bocian, Science 2003, 302, 1543.
13. M. D. Austin, S. Y. Chou, Nano Lett. 2003, 3, 1687.
14. T. Kim, G. Wang, H. Lee, T. Lee, Nanotechnology 2007, 18, 315204.
15. H. B. Akkerman, P. W. M. Blom, D. M. de Leeuw, B. de Boer, Nature 2006, 441, 69.
16. W. Wang, T. Lee, M. A. Reed, Phys. Rev. B 2003, 68, 035416.
17. J. Deng, W. Hofbauer, N. Chandrasekhar, S. J. O'Shea, Nanotechnology 2007, 18, 155202.
18. T. Lee, W. Wang, J. F. Klemic, J. J. Zhang, J. Su, M. A. Reed, J. Phys. Chem. B 2004, 208, 8742.
19. G. S. Bang, J. Park, J. Lee, N.-J. Choi, H.-Y. Baek, H. Lee, Langmuir 2007, 23, 5195.
20. J. F. Watts, J. Wolstenholme, An Introduction to Surface Analysis by XPS and AES, Wiley, UK 2003.
21. S. R. Johnson, S. D. Evans, R. Brydson, Langmuir 1998, 14, 6639.
22. D. V. Leff, L. Brandt, ). R. Heath, Langmuir 1996, 12, 4723.
23. T. Ohji, H.-Y. Sheng, Z.-C. Dong, H. Nejoh, D. Fujita, Appl. Phys. Lett. 2001, 79, 2453.
24. B. de Boer, M. M. Frank, Y. J. Chabal, W. Jiang, E. Garfunkel, Z. Bao, Langmuir 2004, 20, 1539.
25. A. V. Walker, T. B. Tighe, 0. M. Cabarcos, M. D. Reinard, B. C. Haynie, S. Uppili, N. Winograd, D. L. Allara J. Am. Chem. Soc. 2004, 126, 3954.
26. A. Bandyopadhyay, A. J. Pal, Appl. Phys. Lett. 2003, 82, 1215.
27. S. K. Majee, A. Bandyopadhyay, A. J. Pal, Chem. Phys. Lett. 2004, 399, 284.
28. N. Gosvami, K. H. A. Lau, S. K. Sinha, S. J. O'Shea, Appl. Surf. Sci. 2006, 252, 3956.
29. D. J. Wold, C. D. Frisbie, J. Am. Chem. Soc. 2001, 123, 5549.
30. Z. Zhu, T. A. Daniel, M. Maitani, 0. M. Cabarcos, D. L. Allara, N. Winograd, J. Am. Chem. Soc. 2006, 128, 13710.