Thermo-mechanical design of large die fine pitch copper/low-k FCBGA and lead-free interconnections

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Biswas, Kalyan ^a   Liu, Shiguo ^a   Zhang, Xiaowu ^b   Chai, T C ^b  

^a Ibiden Singapore Pte Ltd   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CHIP SCALE PACKAGES; COPPER; COPPER ALLOYS; DIES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FORMING; LIGHT METALS; MATERIALS SCIENCE; NITRIDES; NONMETALS; PASSIVATION; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR MATERIALS; SILICA; SILICON NITRIDE; SPEED; TECHNOLOGY; THERMOMECHANICAL TREATMENT; TWO DIMENSIONAL;

ALUMINUM METALLIZATION; CUT DEPTH; DEVICE SPEED; ELECTRONIC PACKAGING; FILLING MATERIALS; FINE PITCH; FLIP-CHIP PACKAGING; HIGH-DENSITY PACKAGING; INTERNATIONAL CONFERENCES; LEAD-FREE; LOW-K DIELECTRIC MATERIALS; LOW-K MATERIALS; MECHANICAL DESIGNS; ON-CHIP COMMUNICATIONS; PARAMETRIC STUDIES; PLANE STRAINS; SEMICONDUCTOR INDUSTRIES; SILICON DIOXIDES; SILICON NITRIDE PASSIVATION;

DIELECTRIC MATERIALS;

EID: 52449123686     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4606992     Document Type: Conference Paper

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