Underfill selection for reducing Cu/low-K delamination risk of flip-chip assembly

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 233-236

  Wang, Tong Hong ^a   Lai, Yi Shao ^a   Wang, Meng Jen ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DELAMINATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; GLASS TRANSITION; NUMERICAL ANALYSIS; RISK ASSESSMENT; STEEL SHEET; TECHNOLOGY; TESTING; THERMAL CYCLING; THERMAL EXPANSION; THERMAL SPRAYING;

ACCELERATED THERMAL CYCLING TEST; COEFFICIENTS OF THERMAL EXPANSIONS; FINITE ELEMENT MODEL; FLIP-CHIP ASSEMBLIES; FLIP-CHIP PACKAGING; GLASS TRANSITION TEMPERATURES; NUMERICAL PREDICTIONS; NUMERICAL STUDIES; PACKAGING TECHNOLOGIES; PRINCIPAL STRESSES; TEMPERATURE-DEPENDENT; TEST RESULTS; UNDERFILL; UNDERFILLS; YOUNG'S MODULUS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50249111688     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342721     Document Type: Conference Paper

References (10)

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4. th IMAPS Topical Workshop on Flip Chip Technol., Austin, TX, 2004.
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10. Wang, T. H. et al, "Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array," J. Electr. Pack., ASME, Vol. 126, No. 4 (2004), pp. 560-564.