Packaging of copper/low-k IC devices: A novel direct fine pitch gold wirebond ball interconnects onto copper/low-k terminal pads

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 3, 2004, Pages 476-489

  Chungpaiboonpatana, Surasit ^a,b   Shi, Frank ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Mindspeed Conexant Inc ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHEMICAL MECHANICAL POLISHING; CHROMATOGRAPHY; COPPER; DESIGN FOR TESTABILITY; DIELECTRIC MATERIALS; ELECTRIC PROPERTIES; GOLD; INTEGRATED CIRCUIT LAYOUT; OPTICAL PROPERTIES; RELIABILITY; SHEAR STRENGTH;

BENZOTRIAZOLE; DESIGN OF EXPERIMENT; FINE PITCH GOLD WIREBOND; INTEGRATED CIRCUIT DEVICES; REDUCTION ANALYSIS; WIREBOND BALL INTERCONNECTS; WIREBONDING;

ELECTRONICS PACKAGING;

EID: 7244246988     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.831828     Document Type: Article

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