Comprehensive analysis of a larger die, copper pillar bump flip chip package with no-flow underfill

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 575-578

  Zhang, Xiaowu ^a   Pinjala, D ^a   Iyer, Mahadevan K ^a   Chew, Grace ^b   Ma, Zhaohui ^b   Tan, Teck Tiong ^b   Chew, Jimmy ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b Advanpack Solution Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARY FLOW; DIES; FLIP CHIP DEVICES; MOISTURE; STRESSES; THERMOMECHANICAL TREATMENT;

FILLET CRACKING; FLIP CHIP PACKAGES; HYGROSWELLING; PACKAGE STRESSES;

CHIP SCALE PACKAGES;

EID: 33847306990     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. The National Technology Roadmap for Semiconductors: Technology Needs, Semiconductor Industry Association, 1997.
2. http://www.advancpack.com.
3. th ECTC, San Jose, CA, May 18-21, 1997, pp. 850-858.
4. Z. Zhang and C. P. Wong, "Assembly of lead-free bumped flip-chip with no-flow underfills," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 25, No. 2, Apr. 2002, pp. 113-119.
5. T. P. Ferguson and J. Qu, "Moisture absorption in no-flow underfill materials and its effect on interfacial adhesion to solder mask coated FR4 print wiring board," in Proc. 2001 International Symposium on Advanced Packaging Materials, pp. 327-332.
6. R. Thorpe, D. F. Baldwin, B. Smith and L. McGovern, "Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfilll materials," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 2, April 2001, pp. 123-135.
7. T. Y. Tee, C. L. Kho, D. Yap, C. Toh, X. Baraton and Z. W. Zhong, "Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill," Microelectronics Reliability, Vol. 43, 2003, pp. 741-749.
8. K.-S. Moon, L. Fan and C. P. Wong, "The effect toughening of no-flow underfill on fillet cracking of flip-chip device," in Proc. 2001 International Symposium on Advanced Packaging Materials, 2001, pp. 333-340.
9. X. Zhang, E. H. Wong, R. Rajoo, M. K. Iyer, J. F. J. M. Caere, X. J. Zhao, "Development of Process Modeling Methodology for Flip Chip on Flex Interconnections with Non-conductive Adhesive", Microelectronics Reliability, Vol. 45, July 2005, pp. 1215-1221.
10. J. Lu, B. Smith and D. F. Baldwin, "Adhesion characterization of no-flow underfillls used flip chip assemblies and correlation with relaibility," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 1, Jan 2001, pp. 26-30.
11. J. H. Lau, C. Chang and C-C. Chen, "Characteristics and reliability of no-flow underfills for solder bumped flip chip assemblies," Intl. Journal of Microcircuits and Electronic Packaging, Vol. 22, No. 4, 1999, pp. 370-381.