Underfill for low-K silicon technology

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 1-3

  Rajagopalan, Sarathy ^a   Desai, Kishor ^a   Todd, Michael ^b   Carson, George ^b  

^a AGERE SYSTEMS   (United States)

^b Henkel Loctite Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP-CHIP PACKAGES; HENKEL LOCTITE CORP (CO); LSI LOGIC CORP (CO); SILICON TECHNOLOGY;

DATA ACQUISITION; DELAMINATION; FLIP CHIP DEVICES; PERMITTIVITY; POROSITY; RHEOLOGY; SOLDERED JOINTS; THERMAL CYCLING;

SILICON;

EID: 4644335187     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)