Realization of Pb-free FC-BGA technology on Low-k device

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 9-13

  Hayashi, Eiji ^a   Baba, Shinji ^a   Idaka, Shiori ^b   Maeda, Akira ^b   Satoh, Mitsuru ^b   Kimura, Michitaka ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

^b MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED ELECTRICAL DEVICES; FINE WAFERS; FLIP-CHIP BALL-GRID ARRAYS (FC-BGA); SOLDER BUMPS;

HAZARDOUS MATERIALS; LEAD; SOLDERING;

FLIP CHIP DEVICES;

EID: 24644497299     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. K. Nakagawa, et al, High Speed Trasmission and Power Ground Characteritics of FC-BGA Package Over 2,000pin Counts, 12th Micro Electronics Symposium, pp. 255-258, 2002.
2. L. Mercado, et al, Impact of Flip-Chip Packaging on Copper/Low-k structures, IEEE transcations on advanced packaging, vol. 26, No.4, November 2003, pp.433-440.
3. Pei-Haw Tsao, et al, Underfill Characterization for Low-k Dielectric / Cu Interconnect IC Flip-chip Package Reliability, 2004 Electronic Components and Technology Conference, pp. 767-769.
4. E. Hayashi, et al, Pb-free Solder Bump Bonding for High Pin Count Flip-chip BGA Using Organic Substrate, 2003 International Conference on Electronics Packaging, pp. 465-470.