-
1
-
-
0036867396
-
Surface Tension Measurements of the Eutectic Alloy (Ag-Sn 96.2 at. %) with Cu additions
-
Z. Mo ser, W. Ga̧sior, J. Pstruś, S. Ksiȩżarek, Surface Tension Measurements of the Eutectic Alloy (Ag-Sn 96.2 at. %) with Cu additions. Journal of Electronic Materials 31, 11, 1225-1229 (2002).
-
(2002)
Journal of Electronic Materials
, vol.31
, Issue.11
, pp. 1225-1229
-
-
Mo ser, Z.1
Ga̧sior, W.2
Pstruś, J.3
Ksiȩżarek, S.4
-
2
-
-
2142805959
-
-
W. G a̧ s i o r, Z. M o s e r, J. P s t r u ś, K. Bukat, R. K i s i e 1, J. Sitek, (SnAg)eut + Cu Soldering Materials, Part I: Wettability Studies. Journal of Phase Equilibria and Diffusion 25, 2, 115-119 (2004).
-
W. G a̧ s i o r, Z. M o s e r, J. P s t r u ś, K. Bukat, R. K i s i e 1, J. Sitek, (SnAg)eut + Cu Soldering Materials, Part I: Wettability Studies. Journal of Phase Equilibria and Diffusion 25, 2, 115-119 (2004).
-
-
-
-
3
-
-
33645976457
-
-
Z. M o s e r, W. G a̧ s i o r, K. B u k a t, J. Pstruś, R. K i s i e 1, J. S i t e k, K. I s h i d a, I. O h n u m a, Pb-Free Solders: Part 1. Wettability Testing of Sn-Ag-Cu Alloys with Bi Additions. Journal of Phase Equilibria and Diffusion 27, 2, 133-139 (2006).
-
Z. M o s e r, W. G a̧ s i o r, K. B u k a t, J. Pstruś, R. K i s i e 1, J. S i t e k, K. I s h i d a, I. O h n u m a, Pb-Free Solders: Part 1. Wettability Testing of Sn-Ag-Cu Alloys with Bi Additions. Journal of Phase Equilibria and Diffusion 27, 2, 133-139 (2006).
-
-
-
-
4
-
-
33745612954
-
-
Z. M o s e r, W. G a̧ s i o r, J. P s t r u ś, I. O h n u m a, K. I s h i d a, Influence of Sb Additions on Surface Tension and Density of Sn-Sb, Sn-Ag-Sb and Sn-Ag-Cu-Sb Alloys: Experiment vs. Modeling. Int. J. Mat. Res. (formely Z. Metallkd.) 97, 4, 365-370 (2006).
-
Z. M o s e r, W. G a̧ s i o r, J. P s t r u ś, I. O h n u m a, K. I s h i d a, Influence of Sb Additions on Surface Tension and Density of Sn-Sb, Sn-Ag-Sb and Sn-Ag-Cu-Sb Alloys: Experiment vs. Modeling. Int. J. Mat. Res. (formely Z. Metallkd.) 97, 4, 365-370 (2006).
-
-
-
-
5
-
-
0004631999
-
-
M. Miyazaki, M. Mi zu tani, T. Takemo- to, A. Matsunawa, Measurement of Surface Tension with Wetting Balance. Q.J. Japan Weld. Soc. 15, 681-687 (1997).
-
[5]M. Miyazaki, M. Mi zu tani, T. Takemo- to, A. Matsunawa, Measurement of Surface Tension with Wetting Balance. Q.J. Japan Weld. Soc. 15, 681-687 (1997).
-
-
-
-
6
-
-
84864632274
-
-
Z. M o s e r, W. G a̧ s i o r, K. B u k a t, J. Pstruś, R. Ki s ie 1, J. S i te k, K. I s h ida, I. Ohnu- ma, Pb-free Solders: Part III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb Additions, Journals of Phase Equilibria and Dffusion 28, 5 (2007).
-
Z. M o s e r, W. G a̧ s i o r, K. B u k a t, J. Pstruś, R. Ki s ie 1, J. S i te k, K. I s h ida, I. Ohnu- ma, Pb-free Solders: Part III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb Additions, Journals of Phase Equilibria and Dffusion 28, 5 (2007).
-
-
-
-
7
-
-
84864577973
-
-
Z. M o s e r, W. G a̧ s i o r, K. B u k a t, J. P s t r u ś, J. Sitek, Trends in wettability studies of Pb-free solders. ' Basic and application. Part 1 Arch. Mettal. and Mater. 4, 1055-1063 (2008)
-
Z. M o s e r, W. G a̧ s i o r, K. B u k a t, J. P s t r u ś, J. Sitek, Trends in wettability studies of Pb-free solders. ' Basic and application. Part 1 Arch. Mettal. and Mater. 4, 1055-1063 (2008)
-
-
-
-
8
-
-
51349155160
-
-
K. Bukat, J. Sitek, M. Ko ś c i e 1 s k i, Z. M o s e r, W. Ga̧sior, Evaluation of influence of Bi and Sb addition to SnAgCu and SnZn alloys on their surface tension and wetting properties using analysis of variance (ANOVA) Soldering and Surface Mount Technology 20, 4, 9-19 (2008).
-
K. Bukat, J. Sitek, M. Ko ś c i e 1 s k i, Z. M o s e r, W. Ga̧sior, Evaluation of influence of Bi and Sb addition to SnAgCu and SnZn alloys on their surface tension and wetting properties using analysis of variance (ANOVA) Soldering and Surface Mount Technology 20, 4, 9-19 (2008).
-
-
-
-
9
-
-
84889476995
-
-
S. G a n e s a n, M. P e c h t, Lead-free Electronics. John Wiley & Sons, Inc., Publication, (2006). [10] J. S. Hwang, Modern Solder Technology for Competitive Electronics Manufacturing. McGraw-Hill, New York, 1996.
-
S. G a n e s a n, M. P e c h t, Lead-free Electronics. John Wiley & Sons, Inc., Publication, (2006). [10] J. S. Hwang, Modern Solder Technology for Competitive Electronics Manufacturing. McGraw-Hill, New York, 1996.
-
-
-
-
11
-
-
33845230838
-
On the advantages of using a hypoeutectic Sn-Zn as lead-free solder material
-
X. Wei, H. Huang, L. Zhou, M. Zhang, X. Liu, On the advantages of using a hypoeutectic Sn-Zn as lead-free solder material. Materials letters, 61, 655-658 (2007).
-
(2007)
Materials letters
, vol.61
, pp. 655-658
-
-
Wei, X.1
Huang, H.2
Zhou, L.3
Zhang, M.4
Liu, X.5
-
12
-
-
33644897566
-
-
G. Y. Li, B. L. Chen, X. Q. S hi, S. C. K. Won g, Z. F. Wang, Effect of Sb addition on tensile strength of Sn-3.5Ag-0.7Cu solder alloy and joint. Thin Solid Films 504, 421-425 (2006).
-
G. Y. Li, B. L. Chen, X. Q. S hi, S. C. K. Won g, Z. F. Wang, Effect of Sb addition on tensile strength of Sn-3.5Ag-0.7Cu solder alloy and joint. Thin Solid Films 504, 421-425 (2006).
-
-
-
-
13
-
-
0002643382
-
-
A. Z. M i r i c, A. G r u s d, Lead-free alloys. Soldering & Surface Mount Technology 10/1, 19-25 (1998).
-
A. Z. M i r i c, A. G r u s d, Lead-free alloys. Soldering & Surface Mount Technology 10/1, 19-25 (1998).
-
-
-
-
14
-
-
33745054942
-
Reliability of Adhesion Strength of Sn-9Zn-l.5Ag-0.5Bi/Cu during Isothermal Aging
-
C. Y. Liu, M. C. Wang, M. H. Hon, Reliability of Adhesion Strength of Sn-9Zn-l.5Ag-0.5Bi/Cu during Isothermal Aging. J. Electronic Materials 35, 5, 966-971 (2006).
-
(2006)
J. Electronic Materials
, vol.35
, Issue.5
, pp. 966-971
-
-
Liu, C.Y.1
Wang, M.C.2
Hon, M.H.3
-
15
-
-
23844545543
-
-
M. N. Islam, Y. C. Chan, M. J. Rizvi, W. J i 11 e k, Investigations of interfacial reactions of Sn-Zn based and Sn-Ag-Cu lead-free solder alloys as replacement for Sn-Pb solder. Journal of Alloys and Compounds 400, 136-144 (2005).
-
M. N. Islam, Y. C. Chan, M. J. Rizvi, W. J i 11 e k, Investigations of interfacial reactions of Sn-Zn based and Sn-Ag-Cu lead-free solder alloys as replacement for Sn-Pb solder. Journal of Alloys and Compounds 400, 136-144 (2005).
-
-
-
-
16
-
-
19744373254
-
-
J. Z h o u, Y. S u n, F. X u e, Properties of low melting point Sn-Zn-Bi solders. Journal of Alloys and Compounds 397, 260-264 (2005).
-
J. Z h o u, Y. S u n, F. X u e, Properties of low melting point Sn-Zn-Bi solders. Journal of Alloys and Compounds 397, 260-264 (2005).
-
-
-
-
17
-
-
0034269494
-
The effects of flux on the wetting characteristics of near-eutectic Sn-Zn-In solder on Cu substrate
-
S. P. Yu, C. L. Liao, M. H. Hon, M. C. Wang, The effects of flux on the wetting characteristics of near-eutectic Sn-Zn-In solder on Cu substrate. J. Matter Sci. 35, 4217-4224 (2000).
-
(2000)
J. Matter Sci
, vol.35
, pp. 4217-4224
-
-
Yu, S.P.1
Liao, C.L.2
Hon, M.H.3
Wang, M.C.4
-
18
-
-
28444476984
-
-
T. C. Chang, M. C. Wang, M. H. Hon, Thermal properties and interfacial reaction between the Sn-9Zn-xAg lead-free solders and Cu substrate. Metal-. lurgica and Materials Transactions A. 36 A, 3019-3029 (2005).
-
T. C. Chang, M. C. Wang, M. H. Hon, Thermal properties and interfacial reaction between the Sn-9Zn-xAg lead-free solders and Cu substrate. Metal-. lurgica and Materials Transactions A. 36 A, 3019-3029 (2005).
-
-
-
-
19
-
-
0034240575
-
Effects of process parameters on the soldering behaviour of the eutectic SnZn solder on Cu substrate
-
S. P. Yu, H. J. Lin, M. H. Hon, M. C. Wang, Effects of process parameters on the soldering behaviour of the eutectic SnZn solder on Cu substrate. Journal of materials Science: Materials in Electronics 11, 461-471 (2000).
-
(2000)
Journal of materials Science: Materials in Electronics
, vol.11
, pp. 461-471
-
-
Yu, S.P.1
Lin, H.J.2
Hon, M.H.3
Wang, M.C.4
-
20
-
-
0742303043
-
-
C. M. C h u a n g, H. T. H u n g, P. C. L i u, K. L. L i n, The Interfacial Reaction Between Sn-Zn-Ag-Ga-Al Solders and Metallised Cu Substrates. J. Electronic Materials. 33, 1, 7-13 (2004).
-
C. M. C h u a n g, H. T. H u n g, P. C. L i u, K. L. L i n, The Interfacial Reaction Between Sn-Zn-Ag-Ga-Al Solders and Metallised Cu Substrates. J. Electronic Materials. 33, 1, 7-13 (2004).
-
-
-
-
21
-
-
25444439340
-
-
J. M. S on g, P. C. Li u, C. L. Shi h, K. L. Li n, Role of Ag in the Formation of Interfacial Intermetallic Phases in Sn-Zn Soldering. J. Electronic Materials 34, 9, 1249-1254 (2005).
-
J. M. S on g, P. C. Li u, C. L. Shi h, K. L. Li n, Role of Ag in the Formation of Interfacial Intermetallic Phases in Sn-Zn Soldering. J. Electronic Materials 34, 9, 1249-1254 (2005).
-
-
-
-
22
-
-
67650402925
-
-
J. H. V i n c e n t, B. P. R i c h a r d s, D. R. Wa 11 i s, I. A. G u n t e r, A. War w i c k, H. A. H. S t e e n, P. G. H a r r i s, M. A. W h i t m o r e, S. R. B i 11 i n g t o n, A. C. Harm an, E. Knight, Alternative Solders for Electronic Assemblies. Circuit World 19, 3, 32-34 (1993).
-
J. H. V i n c e n t, B. P. R i c h a r d s, D. R. Wa 11 i s, I. A. G u n t e r, A. War w i c k, H. A. H. S t e e n, P. G. H a r r i s, M. A. W h i t m o r e, S. R. B i 11 i n g t o n, A. C. Harm an, E. Knight, Alternative Solders for Electronic Assemblies. Circuit World 19, 3, 32-34 (1993).
-
-
-
-
23
-
-
84864575908
-
-
Z. M o s e r, W. G a̧ s i o r, K. B u k a t, J. P s t r u ś, R. Kisiel,! S i t e k, K. I s h i d a, I. O h n u m a, Pb-free Solders: Part I. Wettability Testing of Sn-Ag-Cu Alloys with Bi Additions. Journal of Phase Equilibria and Diffusion. 27, 2, 133-139 (2006).
-
Z. M o s e r, W. G a̧ s i o r, K. B u k a t, J. P s t r u ś, R. Kisiel,! S i t e k, K. I s h i d a, I. O h n u m a, Pb-free Solders: Part I. Wettability Testing of Sn-Ag-Cu Alloys with Bi Additions. Journal of Phase Equilibria and Diffusion. 27, 2, 133-139 (2006).
-
-
-
-
24
-
-
33744519803
-
-
R. M a y a p p a n, A. B. I s m a i 1, Z. A. A h m a d, T. Ariga, L. B. Hussain, Effect of sample perimeter and temperature on SnZn based lead-free solders. Materials Letters, 60, 2383-2389 (2004).
-
R. M a y a p p a n, A. B. I s m a i 1, Z. A. A h m a d, T. Ariga, L. B. Hussain, Effect of sample perimeter and temperature on SnZn based lead-free solders. Materials Letters, 60, 2383-2389 (2004).
-
-
-
-
25
-
-
9444263076
-
Investigation of interfacial microstructure and wetting property of newly developed Sn-Zn-Cu solders with Cu substrates
-
D. Q. Yu, H. P. Xie, L. Wang, Investigation of interfacial microstructure and wetting property of newly developed Sn-Zn-Cu solders with Cu substrates. Journal of Alloys and Compounds 385, 119-125 (2004)
-
(2004)
Journal of Alloys and Compounds
, vol.385
, pp. 119-125
-
-
Yu, D.Q.1
Xie, H.P.2
Wang, L.3
-
26
-
-
0002643379
-
Microstructure of solder joints with electronic components in lead-free solders
-
Y. Nakamura, Y. Sakakibara, Y. Watan- abe, Y. Anmamoto, Microstructure of solder joints with electronic components in lead-free solders. Soldering & Surface Mount Technology. 10/1, 10-12 (1998).
-
(1998)
Soldering & Surface Mount Technology
, vol.10
, Issue.1
, pp. 10-12
-
-
Nakamura, Y.1
Sakakibara, Y.2
Watan- abe, Y.3
Anmamoto, Y.4
-
27
-
-
67650402926
-
-
G. L. B a i 1 e y, H. C. Wa t k i n s, J. Inst. Met. 80, 57 (1951).
-
G. L. B a i 1 e y, H. C. Wa t k i n s, J. Inst. Met. 80, 57 (1951).
-
-
-
|