Surface-tension measurements of the eutectic alloy (Ag-Sn 96.2 at.%) with Cu additions

Journal of Electronic Materials

Volumn 31, Issue 11, 2002, Pages 1225-1229

  Moser, Z ^a   Gasior, W ^a   Pstrus J ^a   Ksiezarek, S ^b  

^a INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

^b INSTITUTE OF NON FERROUS METALS   (Poland)

Author keywords

(Ag Sn)eut + Cu additions; Butler's method; Density; Pb free soldering materials; Surface tension

Indexed keywords

ADDITION REACTIONS; COPPER; DENSITY OF LIQUIDS; EUTECTICS; SURFACE TENSION;

BUBBLE-PRESSURE METHOD; BUTLER METHOD; STRAIGHT-LINE EQUATIONS; SURFACE TENSION MEASUREMENT;

SILVER ALLOYS;

EID: 0036867396     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0013-y     Document Type: Article

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