메뉴 건너뛰기




Volumn 15, Issue 4, 1997, Pages 681-687

Measurement of surface tension with wetting balance

Author keywords

63Sn 37Pb solder; Lead free solder; Solder surface tension; Surface tension measurement; Wetting balance

Indexed keywords


EID: 0004631999     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.15.681     Document Type: Article
Times cited : (10)

References (17)
  • 1
    • 85033307204 scopus 로고    scopus 로고
    • Japanese source
  • 2
    • 85033284101 scopus 로고    scopus 로고
    • Japanese source
  • 3
    • 0025438866 scopus 로고
    • Stencil Printing of Solder Paste for Fine-Pitch Surface Mount Assembly
    • J.R. Morris and T. Wojcik : "Stencil Printing of Solder Paste for Fine-Pitch Surface Mount Assembly", Soldering & Surface Mount Technology, No. 5, 10 (1990).
    • (1990) Soldering & Surface Mount Technology , Issue.5 , pp. 10
    • Morris, J.R.1    Wojcik, T.2
  • 4
    • 5944236740 scopus 로고
    • Package Option for High Lead Count ASIC Device
    • S.T. Riches : "Package Option for High Lead Count ASIC Device", Hybrid Circuits, No. 2314 (1990).
    • (1990) Hybrid Circuits , Issue.2314
    • Riches, S.T.1
  • 5
    • 5944254695 scopus 로고
    • Facilitating Process and Material Changes in Production Solder with Nitrogen
    • S.M. Adams : "Facilitating Process and Material Changes in Production Solder with Nitrogen". Soldering & Surface Mount Technology, No. 14, 9 (1993).
    • (1993) Soldering & Surface Mount Technology , Issue.14 , pp. 9
    • Adams, S.M.1
  • 6
    • 0029308918 scopus 로고
    • Fine Pitch Surface Mount Technology Assembly with Lead-free, Low Residue Solder Paste
    • I. Artaki, et al. : "Fine Pitch Surface Mount Technology Assembly with Lead-free, Low Residue Solder Paste". Soldering & Surface Mount Technology, No. 20 (1995), 27.
    • (1995) Soldering & Surface Mount Technology , Issue.20 , pp. 27
    • Artaki, I.1
  • 7
    • 0027235121 scopus 로고
    • An Assesment of the Use of Lead in Electronics Assembly-Part 1
    • B.R. Allenby et al. : "An Assesment of the Use of Lead in Electronics Assembly-Part 1", Circuit World, 19, No. 2 (1993), 19.
    • (1993) Circuit World , vol.19 , Issue.2 , pp. 19
    • Allenby, B.R.1
  • 8
    • 85033323062 scopus 로고    scopus 로고
    • Japanese source
  • 11
    • 51249161820 scopus 로고
    • In Search of New Lead-Free Electronic Solders
    • E.P. Wood and K.L. Nimmo : "In Search of New Lead-Free Electronic Solders", Journal of Electronic Materials, Vol. 23, No. 8, (1994), 709.
    • (1994) Journal of Electronic Materials , vol.23 , Issue.8 , pp. 709
    • Wood, E.P.1    Nimmo, K.L.2
  • 12
  • 15
    • 0025841555 scopus 로고
    • Williams, R.O., CHALPHAD, Vol. 15, No. 1 (1991), 1.
    • (1991) CHALPHAD , vol.15 , Issue.1 , pp. 1
    • Williams, R.O.1
  • 16
    • 85033299734 scopus 로고    scopus 로고
    • Japanese source
  • 17
    • 85033280446 scopus 로고    scopus 로고
    • Japanese source


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.