Influence of Sb additions on surface tension and density of Sn-Sb, Sn-Ag-Sb and Sn-Ag-Cu-Sb alloys: Experiment vs. modeling

International Journal of Materials Research

Volumn 97, Issue 4, 2006, Pages 365-370

  Moser, Z ^a   Gasior, W ^a   Pstrus J ^a   Ohnuma, I ^b   Ishida, K ^b  

^a INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

Density; Modeling; Pb free solders; Surface tension

Indexed keywords

ANTIMONY; COPPER; DENSITY MEASUREMENT (SPECIFIC GRAVITY); MATHEMATICAL MODELS; SILVER; SURFACE TENSION; TIN; BINARY ALLOYS; COPPER ALLOYS; EUTECTICS; LEAD ALLOYS; LEAD-FREE SOLDERS; SILVER ALLOYS; TERNARY ALLOYS; TIN ALLOYS;

BUTLER MODEL; DENSITY; LIQUID ALLOYS; PB-FREE SOLDERS;

SOLDERING ALLOYS; SURFACE TENSION;

ALLOY SURFACES; BINARY EUTECTICS; CORRECTION FACTORS; DENSITY; DILATOMETRIC TECHNIQUES; LIQUID ALLOY; MAXIMUM BUBBLE PRESSURE; MODELING; PB FREE SOLDERS; TERNARY EUTECTICS;

EID: 33745612954     PISSN: 18625282     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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