Pb-free solders: Part 1. Wettability testing of Sn-Ag-Cu alloys with Bi additions

Journal of Phase Equilibria and Diffusion

Volumn 27, Issue 2, 2006, Pages 133-139

  Moser, Z ^a   Gasior W ^a   Bukat, K ^b   Pstrus J ^a   Kisiel, R ^c   Sitek, J ^b   Ishida, K ^d   Ohnuma, I ^d  

^a INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

^b TELE AND RADIO RESEARCH INSTITUTE   (Poland)

^c WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^d TOHOKU UNIVERSITY   (Japan)

Author keywords

Density; Meniscographic studies; Pb free solders; Surface tension

Indexed keywords

BISMUTH; CONTACT ANGLE; DENSITY (SPECIFIC GRAVITY); EUTECTICS; LEAD; SURFACE TENSION; TERNARY SYSTEMS; TESTING; TIN ALLOYS; WETTING;

DENSITY; MENISCOGRAPHIC STUDIES; PB-FREE SOLDERS; WETTING ANGLES;

SOLDERING;

EID: 33645976457     PISSN: 15477037     EISSN: None     Source Type: Journal    
DOI: 10.1361/154770306X97155     Document Type: Article

References (17)

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