Reliability of adhesion strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during isothermal aging

Journal of Electronic Materials

Volumn 35, Issue 5, 2006, Pages 966-971

  Liu, Chih Yao ^a   Wang, Moo Chin ^b   Hon, Min Hsiung ^a,c  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL UNITED UNIVERSITY   (Taiwan)

^c DA YEH UNIVERSITY   (Taiwan)

Author keywords

Cu substrate; Interfacial adhesion strength; Intermetallic compounds (IMCs); Lead free solder

Indexed keywords

CU SUBSTRATES; INTERFACIAL ADHESION STRENGTH; ISOTHERMAL AGING; LEAD-FREE SOLDERS;

ADHESION; AGING OF MATERIALS; INTERMETALLICS; ISOTHERMS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

TIN ALLOYS;

EID: 33745054942     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692555     Document Type: Conference Paper

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