Investigation of dissolution inhibitors for electrochemical mechanical planarization of copper using beta-alanine as a complexing agent

Journal of Applied Electrochemistry

Volumn 38, Issue 10, 2008, Pages 1347-1356

  Klug, B K ^a   Pettit, C M ^b   Pandija, S ^a   Babu, S V ^a   Roy, D ^a  

^a CLARKSON UNIVERSITY   (United States)

^b EMPORIA STATE UNIVERSITY   (United States)

Author keywords

Beta alanine; CMP; Copper; ECMP; Impedance spectroscopy; Surfactant

Indexed keywords

AMMONIUM COMPOUNDS; COPPER; DOPING (ADDITIVES); ELECTROCHEMICAL CORROSION; FOURIER TRANSFORMS; SURFACE REACTIONS;

BETA-ALANINE; CMP; ECMP; IMPEDANCE SPECTROSCOPY; SURFACTANT;

ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY;

EID: 51349138380     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10800-008-9570-y     Document Type: Article

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